Samsung Electro-mechanics Co., Ltd.

Yul-Kyo Chung

Hwa-sun Park

Doo-hwan Lee

Sung Yi

Young-Do Kweon

Kyung-Min Lee

Hyun-ho Kim

Woon-Chun Kim

Jae-Kul Lee

Seog-Moon Choi

Moon-Il Kim

Soon-Gyu Yim

Sang-Chul Lee

Jin-Soo Jeong

Sung-Taek Lim

Jin-Gu Kim

Jung-Soo Byun

Ki-Jung Sung

Mike Kim

Won-Geun Jung

Jong-Woon Kim

Young-Kwan Lee

Seung-Eun Lee

Kim Woon-Chun

Sung-Taek 1001 West Wing Hyundai I-Park Lim

A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.

Circuit board and method of manufacturing the same

A method of processing a cavity of a core substrate is disclosed. The method of processing a cavity of a core substrate in accordance with an embodiment of the present invention can include: forming a first processing area on one surface of a core substrate, the first processing area being demarcated by a circuit pattern; forming a second processing area on the other surface of the core substrate, the second processing area being demarcated by a circuit pattern; and processing a cavity by removing the entire first processing area from the one surface of the core substrate.

Method of processing cavity of core substrate

An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

Electronics component embedded PCB

A PCB strip and a method of manufacturing an electronic component embedded printed circuit board are disclosed. The PCB strip in accordance with an embodiment of the present invention includes a unit area, which has a plurality of substrate units provided therein, and a dummy area, which is provided on an outer side of the unit area. Here, an electronic component can be embedded in the substrate unit, and an electrostatic discharge preventing component for protecting the electronic component from an electrostatic discharge can be embedded in the dummy area.

PCB strip and manufacturing method for electronic component embedded PCB

A method of testing a passive device embedded printed circuit board is disclosed. The method in accordance with an embodiment of the present invention includes: applying an AC power to a printed circuit board in which a filter including at least two of a resistor, an inductor and a capacitor is embedded; measuring a property of the filter for the applied AC power; and determining whether or not the printed circuit board is defective by comparing the measured property of the filter with a design value.

Test method for passive device embedded printed circuit board

A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

Capacitor and manufacturing method thereof

A semiconductor chip package and a printed circuit board having an embedded semiconductor chip package are disclosed. The semiconductor chip package may include a semiconductor chip that has at least one chip pad formed on one side, and a capacitor formed on the other side of the semiconductor chip.

Semiconductor chip package and printed circuit board

A method of manufacturing a component-embedded printed circuit board is disclosed. The method includes: forming a blind hole in the first metal layer such that the first insulation layer is exposed, for a metal-clad laminate that includes a first metal layer stacked over a first insulation layer, securing a component to the first insulation layer by embedding the component in the blind hole, stacking a second insulation layer and a second metal layer on either side of the metal-clad laminate, and forming circuit patterns by removing portions of the metal layers.

Method of manufacturing component-embedded printed circuit board

Growing community of inventors

Yongin-si, South Korea

Yul-Kyo Chung