Contemporary Amperex Technology (hong Kong) Limited

Contemporary Amperex Technology Limited

Yukun Wu

Xiaoping Zhang

Wenzhu Xu

Xiaoming Ge

A method for preparing an electrolytic copper foil includes placing an anode and a cathode to be plated in a twin crystal growth agent containing electroplating solution in an electroplating tank, and, under conditions that the electroplating solution is provided with randomly alternating transitions of one or two of an ultrasonic wave at a frequency f11 and an ultrasonic wave at a frequency f12 and one or two of an ultrasonic wave at a frequency f21 and an ultrasonic wave at a frequency f22, performing direct current electroplating to obtain the electrolytic copper foil, wherein f11>40 kHz, 15 kHz<f12≤40 kHz, 0 kHz<f21≤15 kHz, and f22=0 kHz.

Electrolytic copper foil and preparation method therefor, negative electrode plate, secondary battery, battery module, battery pack and power consuming device

A top cap assembly includes a top cap plate, a mounting piece, and a protection film. The top cap plate includes an inner side and an outer side disposed opposite to each other along a thickness direction of the top cap plate, the inner side and the outer side are spaced apart from each other to form a receptacle in between, and the receptacle communicates with an outside space. The mounting piece is disposed protrusively in the receptacle and comprising a fixed end and a free end disposed opposite to each other. The fixed end is disposed on a wall of the receptacle, and the free end extends along the thickness direction of the top cap plate and is spaced apart from the wall of the receptacle to form a threading clearance. One end of the protection film is attached to the mounting piece through the threading clearance.

Growing community of inventors

Ningde, China

Yukun Wu