Honda Motor Co., Ltd.

Yuko Yamada

Takahiro Uneme

Takahiro Hagimoto

Masami Ogura

Hiroo Yamaguchi

Tsukasa Aiba

Fumitomo Takano

Jun Kato

Shinichi Yataka

Takahito Takayanagi

Tsugio Masuda

A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached.

Power conversion apparatus

A power converter () includes: planar semiconductor modules () each having a resin sealing part () in which a semiconductor element (), conductive members (, and), and a signal terminal () are sealed with a resin; a cooler () that holds the plurality of semiconductor modules () in a laminated manner; and a cover () that covers the semiconductor modules and the cooler, wherein at least a part of the resin sealing part () and the cooler () are supported by support media (and) that extend from the cover () so that facing parts of the resin sealing part and the cooler with respect to the cover () is positioned in proximity to the cover, and the conductive members and the signal terminal protrude from the resin sealing part in a direction away from the cover.

Power converter

A power converter includes: a refrigerant flow channel member in which a refrigerant cooling an electronic device flows; a flat refrigerant pipe portion stacked with a power module, provided for a refrigerant cooling the power module to flow therein, and including a contact surface portion contacting the power module to exchange heat; an inlet pipe portion that is disposed at one end of the refrigerant pipe portion and through which the refrigerant flows to the refrigerant pipe portion; an outlet pipe portion that is disposed at the other end of the refrigerant pipe portion and through which the refrigerant flows from the refrigerant pipe portion; an inlet connection portion connecting the inlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member; and an outlet connection portion connecting the outlet pipe portion to the refrigerant flow channel member and formed of a tubular elastic member.

There is provided a semiconductor device including: a circuit board formed by bonding a first and a second metal plates to both surfaces of an insulating substrate respectively, at least one semiconductor element to be bonded to an external surface of the first metal plate through a first solder, and a radiating base plate to be bonded to an external surface of the second metal plate through a second solder, wherein the first and the second solders are constituted by solder materials of the same type, and a ratio of a sum of thicknesses of the first and the second metal plates to a thickness of the insulating substrate is set in a predetermined range to ensure an endurance to a temperature stress of each of the first and the second solders.

Growing community of inventors

Saitama, Japan

Yuko Yamada