Sumitomo Chemical Company, Limited

Samsung Electronics Co., Ltd.

Yuko Yako

Kenji Takahashi

Nobuhito Fukui

Naoki Takeyama

Hiroshi Takagaki

Hi-Kuk Lee

Kyu-Young Kim

Yuji Ueda

Dong-Ki Lee

Takehiro Kusumoto

Shigeki Yamamoto

A photosensitive resin composition includes an alkali-soluble resin, a quinone diazide, a surfactant, and a solvent. The solvent includes a diethylene glycol dialkyl ether that includes an alkyl group including one to five carbon atoms, an ethyl 3-ethoxy propionate, an alkyl acetate that includes an alkyl group including three to eight carbon atoms, and an alkyl lactate that includes an alkyl group including one to six carbon atoms. The composition may be used to make high-quality display panels with uniformly-coated insulating layers.

Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel

A positive working photoresist composition is provided which comprises a resin which is converted to alkali-soluble from alkali-insoluble or alkali slightly soluble by the action of an acid; an acid generator; and a nitrogen-containing cyclic compound represented by the following formula (I):

Positive working photoresist compositions comprising a nitrogen-containing cyclic compound

A chemical amplifying type positive photoresist composition, excellent in various properties, and not form necking at the potion where the bottom antireflective coating and the resist film contact, which comprises (A) a resin which is converted to alkali-soluble from alkali-insoluble or alkali slightly soluble by the action of an acid, (B) an acid generator, (C) a tertiary amine compound and (D) a diphenyl sulfone compound, and a fine photoresist pattern can be formed in high precision using the photoresist composition.

Photoresist composition

A chemical amplifying type positive photoresist composition, excellent in various properties such as film retention ratio, applicability, heat resistance, sensitivity, resolution, profile and time delay resistance, and not easily affected by environment, which comprises (A) a resin which is converted to alkali-soluble by the action of an acid, (B) an acid generator and (C) a tertiary amine compound having an ether bond; and a fine photoresist pattern can be formed in high precision using the photoresist composition.

A positive photoresist composition having excellent various performances (e.g. resolution, resistance to time delay effect, profile), small PEB dependence as well as excellent sensitivity, film retention and coatability, which comprises a polyvinylphenol resin whose phenolic hydroxyl group is partially protected; a sulfonate of a N-hydroxyimide compound as an acid generator; an amine compound; and an electron donor having a redox potential of not more than 1.7 eV is provided.

A positive photo resist composition of chemical amplifying type, which is excellent in various properties such as sensitivity resolution, heat resistance, film retention ratio, applicability and profile and also excellent in time delay effect resistance, and which comprises

Positive resist composition

A positive photo resist composition of chemical amplifying type, which is excellent in various properties such as sensitivity, resolution, heat resistance, film retention ratio, applicability and profile and also excellent in time delay effect resistance, and which comprises

A positive-working photoresist composition which exhibits a high sensitivity and a high resolution in addition to excellent characteristics such as heat resistance, film retention ratio, coatability and profile;

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Takatsuki, Japan

Yuko Yako