Kyocera Corporation

Yuko Tanaka

Takayuki Kimura

Hisaki Masuda

Takayuki Ohyama

Yoshihiro Uemura

Hiroyuki Miura

A lid body includes a base containing an alloy of iron and nickel, a first film positioned on a lower surface of the base and containing nickel, and a second film positioned on a lower surface of the first film and containing copper. During welding of the lid body, penetration of crystal grain boundaries of the base by Cu of the second film is reduced by the first film. Therefore, occurrence of cracks in the base is reduced and thus a package with high airtightness can be formed.

Lid body, electronic component accommodation package, and electronic device

A board in an aspect of the present invention includes a substrate, a first film, a first layer, and a second film. The substrate has a first elastic modulus. The first film is at an upper surface of the substrate. The first layer is at a lower surface of the substrate. The first layer has a second elastic modulus lower than the first elastic modulus and has a first thermal expansion coefficient. The second film is at a lower surface of the first layer. The second film includes the same material as the first film and has a second thermal expansion coefficient lower than the first thermal expansion coefficient.

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Kyoto, Japan

Yuko Tanaka