Showa Denko K.k.

Yuko Sakata

Masato Fukushima

Hiroshi Uchida

Kazuhiko Sato

Tomoyuki Takei

Masanori Ookoshi

Ritsuko Hirakawa

The present invention provides a technique capable of manufacturing a resin stamper at a low cost. A method of manufacturing a plate-shaped resin stamper includes: pressing a resin composite base material against a mother stamper having a pattern formed on the surface thereof by compression molding to transfer the pattern of the mother stamper to the composite base material; and punching the composite base material. In the manufacturing method, the resin composite base material includes at least one curing resin. In addition, during the compression molding, a portion of the composite base material is cured by active energy beams or heat, the pattern is transferred to the composite base material, and the composite base material is punched, thereby manufacturing the resin stamper.

Method and apparatus for manufacturing resin stamper, imprint method, magnetic recording medium, and magnetic recording/reproducing apparatus

A resin composition for sealing a light-emitting device of the present invention includes a silsesquioxane resin including two or more oxetanyl groups, an aliphatic hydrocarbon including one or more epoxy groups and a cationic polymerization initiator. Furthermore, a lamp of the present invention includes a package equipped with a cup-shaped sealing member, an electrode exposed in the bottom portion of the sealing member, and a light-emitting device arranged on the bottom portion and electrically connected with the electrode, wherein the light-emitting device is sealed with the above-described resin composition for sealing a light-emitting device filled in the sealing member.

Resin composition for sealing light-emitting device and lamp

There is provided a novel method for producing a bifunctional epoxy monomer which comprises reacting diolefin with a hydrogen peroxide aqueous solution, in the presence of molybdenum or tungsten oxide as a catalyst to selectively epoxidize a double bound at a specific position. The bifunctional epoxy monomers provided by the present invention are substances widely used in various industrial fields such as chemical industry, as materials for resist materials (particularly solder resist materials), and intermediates of agrochemicals and medicines, and various polymers such as plasticizers, adhesives and coating resins.

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Tokyo, Japan

Yuko Sakata