Panasonic Corporation

Kurita Water Industries Ltd.

Dkk-toa Corporation

Yuko Konno

Hiroaki Fujiwara

Shingo Yoshioka

Tsuyoshi Takeda

Hiromitsu Takashita

Yukimasa Shimura

Shintarou Mori

Satoshi Takizawa

Tetsuya Sato

Hiromitsu Hachiya

Shuji Sugawara

A residual chlorine measuring apparatus includes: a detection electrode that is immersed in a sample solution, the detection electrode being made of gold or platinum; a counter electrode that is immersed in the sample solution, the counter electrode being made of silver/silver chloride; a voltage applying device that applies an applied voltage between the detection electrode and the counter electrode; an ammeter that measures an oxidation-reduction current flowing between the detection electrode and the counter electrode; and an arithmetic controller that controls the voltage applying device and acquires the oxidation-reduction current measured by the ammeter.

Residual chlorine measuring apparatus and method of measuring residual chlorine

The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.

Electronic components assembly

The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when &#x2208;1 represents an absorbance coefficient per unit weight of a resin filmin a solution prepared by dissolving, in a solvent, the resin filmformed by application of the resin composition as a liquid, &#x2208;1 at a light wavelength at which the resin filmis to be irradiated is at least 0.01 (L/(g&#xb7;cm)).

Resin composition and method for producing circuit board

A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor deviceof which a plurality of connecting terminals are exposed, a resin film is formed on a surface of the insulating layer, a groove of a depth equal to or exceeding a thickness of the resin film is formed from a surface side of the resin film so that the groove passes in a vicinity of connecting terminals that are to be connected, and furthermore communicating holes which reach the connecting terminals to be connected from this portion that groove passes in the vicinity thereof are formed.

Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board

Water quality analyzer

Growing community of inventors

Tokyo, Japan

Yuko Konno