Nikon Corporation

Yuko Kitade

Atsushi Tanaka

Toshihisa Tanaka

While data that indicate a relationship between a dressing position P defined by a distance between a rotating shaftof a polishing padand a rotating shaftof a dresserand shape change of the polishing padbased on input of a target shape of the polishing padand alternating repetition of dressing the polishing padby the dresserand measurement of shape of the polishing padby a pad shape measurement instrumentis acquired at a stage prior to commencement of a series of polishing steps for continuously polishing a plurality of polishing target objects (semiconductor wafer W) by a polishing tool, the polishing padis machined to the target shapewhile the dressing position P is controlled, whereby the dressing position P is set during the polishing steps on the basis of a processing result of this data.

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Saitama-ken, Japan

Yuko Kitade