Disco Corporation

Yukiyasu Masuda

Yoshinori Kakinuma

Yoshinobu Saito

Toshiyuki Yoshikawa

Kentaro Odanaka

Toshio Tsuchiya

Masanobu Takenaka

Tomoyuki Hongo

Takashi Mori

Yoshikuni Migiyama

Jonghyun Ryu

Takashi Sampei

Takashi Uchiho

Zentaro Kawasaki

Mayumi Kusakawa

Ryosuke Kurosawa

A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the annular frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to the back surface of the wafer, a frame unit carrying-out unit, and a reinforcing part removing unit that cuts and removes a ring-shaped reinforcing part from the wafer of a frame unit.

Processing apparatus

A workpiece processing method for processing a workpiece using a processing apparatus including a chuck table, a processing unit, a moving mechanism for moving the chuck table and the processing unit relative to each other, and an imaging unit for imaging the workpiece, where the chuck table includes a holding member formed by a transparent body and a supporting member supporting a part of the holding member and connected to an angle control mechanism. The method includes a tape affixing step, a holding step of holding the workpiece by the chuck table via the tape, and an identifying step of imaging the top surface side of the workpiece through the transparent holding member by the imaging unit positioned in a region that is on a lower side of the holding member and is not superimposed on the supporting member, and identifying a region to be processed in the workpiece.

Processing apparatus and workpiece processing method

A cleaning apparatus includes a spinner table for holding a workpiece thereon, a cleaning nozzle for supplying cleaning water to the workpiece held on the spinner table, an ultrasonic vibrator for applying ultrasonic vibrations to the cleaning water supplied from the cleaning nozzle to the workpiece, a water layer forming unit for forming a layer of the cleaning water in a clearance between the cleaning nozzle and the workpiece, the water layer forming unit having a cover surrounding the cleaning nozzle, and a drain unit for draining the cleaning water out of the cleaning apparatus, the drain unit having a flow channel for allowing the cleaning water supplied from the cleaning nozzle to the workpiece to flow therethrough.

Cleaning apparatus

A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

A processing apparatus includes a chuck table configured to hold a workpiece by a holding surface, a processing unit configured to process the workpiece held by the chuck table, a moving mechanism configured to move the chuck table and the processing unit relative to each other along a direction parallel with the holding surface of the chuck table, an angle control mechanism disposed on the moving mechanism and on a lower side of the chuck table, the angle control mechanism controlling an angle of the chuck table, and an imaging unit configured to image the workpiece held by the chuck table, the chuck table including a holding member formed by a transparent body and holding the workpiece and a supporting member supporting a part of the holding member and connected to the angle control mechanism.

A processing apparatus includes a holding table. The holding table includes a frustoconical portion and a wafer holding portion formed on the upper surface of the frustoconical portion for holding the wafer. Light is applied from a light emitting member to the side surface of the frustoconical portion and next reflected on the side surface of the frustoconical portion. The light reflected is applied to the outer circumference of the wafer held on the wafer holding portion of the holding table to thereby image the outer circumference of the wafer by an imaging unit.

A laser processing apparatus includes a laser oscillator configured to oscillate a laser beam, a first condenser configured to focus an S-polarized laser beam, a second condenser configured to focus a P-polarized laser beam, an X-moving unit configured to processing-feed a holding table that holds a wafer thereon in X directions, and first and second indexing feed units configured to indexing-feed the first and second condensers respectively in Y directions. While the wafer is being processed with the laser beam from the first condenser along a projected dicing line on the wafer in the X directions, the second condenser is indexing-fed and positioned on a next projected dicing line along which to process the wafer.

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Tokyo, Japan

Yukiyasu Masuda