Ricoh Company, Ltd.

Ricoh Elemex Corporation

Other

Ricoh Seiki Company, Ltd.

Fraunhofer-gesellschaft Zur Foerderung Der Angewandten Forschung E.v.

Stanley Electric Co., Ltd

Yukito Sato

Hiroyoshi Shoji

Morimasa Kaminishi

Junichi Azumi

Takayuki Yamaguchi

Tetsurou Saitoh

Shunichi Sato

Shuichi Suzuki

Eiji Mochizuki

Akihiro Itoh

Kouichi Ohtaka

Goichi Akanuma

Mitsuteru Kimura

Yoshiaki Yasuda

Masafumi Kumano

Masayoshi Esashi

Mitsugu Irinoda

Masanao Tani

Mizuki Shinkawa

Masahiro Akamatsu

Seiichi Kato

Takeshi Hino

Joerg Froemel

Mitsuhiro Yoda

Mochizuki Eiji

An optical deflector includes a mirror configured to reflect light; a pair of support portions each having an end connected to the mirror, and configured to support the mirror; first actuators connected to the respective support portions, and configured to deform the support portions so as to cause the mirror to oscillate about a first axis; a movable frame configured to support the first actuators; and second actuators connected to the movable frame and disposed opposite to the first actuators, with the support portions being interposed between the first actuators and the second actuators. The second actuators are not connected to the support portions. The first actuators and the second actuators bend and deform in the same direction.

Optical deflector, deflection apparatus, distance measuring apparatus, image projecting apparatus, and movable body

An atomic oscillator is disclosed, including an Alkaline metal cell, a light source illuminating a laser beam to the Alkaline metal cell, and a light detector detecting light passing through the Alkaline metal cell. The Alkaline metal cell includes a first member, a second member, a cell internal portion, and an Alkaline metal raw material. In the first member, a first glass substrate is bonded on a second surface of a first substrate where a first opening part is formed. In the second member, a second glass substrate is bonded to a fourth surface of a second substrate where a second opening part is formed. The cell internal portion is formed by the first opening part and the second opening part by bonding the first surface to the third surface. The Alkaline metal raw material is enclosed by the cell internal portion.

Atomic oscillator and method for fabricating atomic oscillator

An optical deflector includes a plurality of piezoelectric unimorph oscillating bodies (to) that cause a reflecting plate () to oscillate rotationally, centering upon a pair of flexible support units (and). The optical deflector forms a single structure of the oscillating plates (to), the reflecting plate (), the flexible support units (and), and a support body (), by connecting one set of the terminals of the oscillating plates (to) of the suite of piezoelectric unimorph oscillating bodies (to) to the flexible support units (and), and connecting the other set of terminals to the support body (). Furthermore, the plurality of piezoelectric unimorph oscillating bodies (to) each respectively comprise a plurality of parallel oscillating bodies (to--to--to-), and (-to-), and a suite of parallel actuators (-to--to-, and-to-).

Optical deflector and optical device

A vibration unit including a frame, a vibration element including a substrate configured to vibrate, and a beam configured to connect the vibration element to the frame. The vibration unit is produced by applying an etching process to at least two surfaces of a substrate. A meeting position of the two surfaces of the substrate is located where a first etching process, which takes place on a first surface of the substrate and a second etching process, which takes place on a second surface of the substrate meet, and is located at a position other than a center position in a width direction of the beam.

Vibration elements

A functional element package includes a silicon substrate with a functional element having one of a mobile portion and a sensor thereon; a seal member being bonded with the silicon substrate to form an airtightly sealed space therein, and including a step portion in its height direction; a first wiring portion being connected with the functional element and extending from the airtightly sealed space to an outside thereof; a second wiring portion being different from the first wiring portion and extending from the step portion to an upper surface of the seal member; and a bump on the second wiring portion, in which the first wiring portion is bent towards the airtightly sealed space and connected via a photoconductive member with the second wiring portion on the step portion.

Functional element package and fabrication method therefor

The present invention provides a deflection mirror including a mirror substrate having a mirror face that reflects a light, a beam, and a supporting member that supports the mirror substrate through the beam. A movable electrode is formed at a free side of the mirror substrate. A fixed electrode is operably linked through the movable electrode at a gap that is formed in the supporting member. The mirror substrate is driven by electrostatic force between the movable electrode and the fixed electrode and vibrates centering of the beam. An end of at least one of the fixed electrode and the movable electrode is smaller in the thickness direction than the other end.

Deflection mirror, a deflection mirror manufacturing method, an optical writing apparatus, and an image formation apparatus

An ink jet head and a method of producing the same are disclosed. Use is made of a sufficiently thick single crystal at the time of anodic bonding, so that a vibration plate is free from deformation without resorting to any special short-circuit electrode.

Ink jet head and method of producing the same

A thin-film microstructure sensor includes a substrate having an insulation layer. A thin-film platinum temperature-sensitive resistor is provided on the insulation layer of the substrate, the thin-film platinum temperature-sensitive resistor comprising a platinum layer, the platinum layer having a maximum crystal grain size above a reference grain size of 800 &angst;. The thin-film platinum temperature-sensitive resistor is formed by a sputtering process to provide a temperature coefficient of resistance TCR above a reference TCR level of 3200 ppm.

Method of producing a thin-film platinum temperature-sensitive resistor for a thin-film microstructure sensor

A thin-film microstructure sensor includes a substrate having an insulation layer. A thin-film platinum temperature-sensitive resistor is provided on the insulation layer of the substrate, the thin-film platinum temperature-sensitive resistor comprising a platinum layer, the platinum layer having a maximum crystal grain size above a reference grain size of 800 .ANG.. The thin-film platinum temperature-sensitive resistor is formed by a sputtering process to provide a temperature coefficient of resistance TCR above a reference TCR level of 3200 ppm.

Thin-film microstructure sensor having a temperature-sensitive resistor

A method of calibrating a zero point of a flow sensor includes the steps of detecting a transition of output of the flow sensor caused in response to a shut down of a fluid, and adjusting the zero point of a characteristic curve representing the output of the flow sensor and a flow rate, such that the indicated flow rate is zero immediately after the transition of the flow sensor output.

Calibration method of a flow sensor output

A flow sensor includes a first heating portion, provided at a first position in a flow of a fluid, which heats the fluid and outputs a voltage in response to a temperature of the first position. A second heating portion, provided at a second, downstream position in the flow of the fluid, heats the fluid and outputs a voltage in response to a temperature of the second position, the first position and the second position being spaced from each other in a direction parallel to the flow of the fluid. An intermediate heater, provided between the first heating portion and the second heating portion, heats the fluid at an intermediate position between the first position and the second position.

Flow sensor having an intermediate heater between two

A flow sensor eliminates turbulence of fluid flow due to a structure of the temperature detecting portion so that a temperature of the temperature detecting portions does not fluctuate due to the turbulence of the fluid. The flow sensor is formed on a substrate. Each of a first temperature detecting portion and a second temperature detecting portion has a heating function and a temperature detecting function, and are arranged along a direction of flow of the fluid. A supporting portion is formed on the substrate for supporting the first and second temperature detecting portions thereon. The supporting portion does not have a side surface facing substantially in the direction of flow of the fluid. A side surface of the supporting portion is protected by a guard portion formed along the side surface.

Flow sensor having first and second temperature detecting portions for

An apparatus for zone melting a thin semiconductor film comprises an first laser for heating the thin semiconductor film, at least one additional laser for heating an insulating substrate, a first temperature detecting device for detecting the temperature of a melted portion of the thin semiconductor film, and a second temperature detecting device for detecting the temperature of a solidified portion of the thin semiconductor film. The apparatus further comprises a first controller for controlling an output of the first laser so as to maintain the temperature of the melted portion in a first predetermined temperature range, and a second controller for controlling an output of the additional laser so as to maintain the temperature of the solidified portion in a second predetermined temperature range.

Growing community of inventors

Sendai, Japan

Yukito Sato