Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Yukiteru Sugaya

Masanori Kato

Syunsuke Kido

Hiroshi Matsubara

Shinya Mizoguchi

Takanori Uejima

Atsushi Ono

Masaki Tada

Keisuke Nishio

A multiplexer includes filters and low pass filters. A second frequency band and a third frequency band are partially different. A first frequency band does not overlap the second frequency band and the third frequency band. One end of the filter is connected to a common terminal and the other end is connected to an input/output terminal. The low pass filter is connected in one end to the common terminal and in the other end to one end of the filter. The other end of the filter is connected to one end of the low pass filter. The other end of the low pass filter is connected to the input/output terminal. One end of the filter is connected to a node between the other end of the low pass filter and one end of the filter and the other end of the filter is connected to the input/output terminal.

Multiplexer and communication device

In a radio-frequency module, a hybrid filter includes an acoustic wave filter including at least one acoustic wave resonator, an inductor having a winding portion, and a capacitor. A plurality of outer electrodes of the acoustic wave filter includes a first input and output electrode connected to a first signal terminal, a second input and output electrode connected to a second signal terminal, and a ground electrode connected to a ground terminal. The inductor is disposed on a first major surface of a mounting substrate and is adjacent to the acoustic wave filter in plan view in a thickness direction of the mounting substrate. When viewed in a direction of a winding axis of the winding portion of the inductor, an inner part of the winding portion in the inductor does not overlap any of the first input and output electrode, the second input and output electrode, and ground electrode.

Radio-frequency module and communication device

A high-frequency module includes a mounting substrate, a filter, and a common inductor. The mounting substrate includes a first main surface and a second main surface facing each other. The filter includes series arm resonators and parallel arm resonators, and is disposed on the first main surface. The mounting substrate includes a ground terminal on the second main surface. A first end of the common inductor is connected to all of the parallel arm resonators. A second end of the common inductor is connected to the ground terminal.

High-frequency module and communication device

A high-frequency module includes a module substrate including an internal wiring pattern, and a SAW filter including a piezoelectric substrate, an electrode pattern on the piezoelectric substrate, a support surrounding the electrode pattern, and a cover on the support covering the electrode pattern to define a hollow space together with the support and the piezoelectric substrate. The module substrate, the cover, and the piezoelectric substrate are disposed in this order in a perpendicular or substantially perpendicular direction with respect to the module substrate, and a shield electrode is provided on a surface of the cover that faces the module substrate or on a surface of the cover that faces the piezoelectric substrate.

High-frequency module

A filter includes a first input/output electrode and the second input/output electrode, and is arranged on a first main surface of a mounting substrate. The mounting substrate includes a first land electrode, a second land electrode, a ground terminal, and a plurality of via conductors. The first land electrode is connected to the first input/output electrode. The second land electrode is connected to the second input/output electrode. The ground terminal is located closer to a second main surface side than the first main surface in a thickness direction of the mounting substrate. The plurality of via conductors is arranged between the first main surface and the second main surface, and is connected to the ground terminal. The plurality of via conductors is located between the first land electrode and the second land electrode in a plan view from the thickness direction of the mounting substrate.

High-frequency module, high-frequency circuit, and communication device

A wiring board includes couplers and external connection terminals including a first terminal group including a first antenna terminal and a first monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a first spacer terminal between the first antenna terminal and the first monitor terminal, and a second terminal group including a second antenna terminal and a second monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a second spacer terminal between the second antenna terminal and the second monitor terminal.

Wiring board, coupler module, and communication device

A transmission filter in a high frequency module includes serial arm resonators electrically connected in series to a serial arm electrically connecting a shared terminal and a transmission terminal, parallel arm resonators each electrically connected in series to each of parallel arms electrically connecting the serial arm and a ground, a first inductor electrically connected between the ground and a connection end electrically connecting at least the two parallel arm resonators of the parallel arm resonators, and a second inductor electrically connected between the ground and one parallel arm resonator different from the at least two parallel arm resonators of the parallel arm resonators. The second inductor is electromagnetic field coupled to at least one of an antenna side matching element, a transmission side matching element, and a portion of the serial arm in the transmission filter. The first and second inductors obstruct electromagnetic field coupling therebetween.

High frequency module

A high-frequency module includes a SAW filter including a piezoelectric substrate and an electrode pattern provided on the piezoelectric substrate, a module substrate, a resin member covering the SAW filter, and a wiring pattern connected to the electrode pattern and provided on the resin member. The electrode pattern and the wiring pattern are inductively coupled, capacitively coupled, or inductively coupled and capacitively coupled with each other.

A switch module includes a switch circuit and a filter. The switch circuit includes two or more selection terminals, a common terminal provided for the two or more selection terminals, and first and second bypass terminals. The filter is connected between the first and second bypass terminals and reduces harmonics of a radio-frequency signal which passes through the filter. The switch circuit is selectively switched between a first connection mode and a second connection mode. In the first connection mode, the common terminal is connected to any of the two or more selection terminals. In the second connection mode, the common terminal is connected to the first bypass terminal and the second bypass terminal is connected to any of the two or more selection terminals.

Switch module and radio-frequency module

A radio frequency module includes a transmission terminal, a transmission filter connected to the transmission terminal, a common terminal, a reception filter which is connected to the common terminal, a reception terminal, a branch point to which the common terminal, the transmission filter, and the reception filter are connected, a transmission path connecting the transmission terminal and the branch point, a reception path connecting the reception terminal and the branch point, a common path connecting the common terminal and the branch point, a matching circuit connected to the common path, and an inductor circuit that includes a first inductor that defines a propagation path through electromagnetic coupling to at least one of the transmission path, the common path, the matching circuit, and the reception path, and a second inductor that is positioned so as not to be electromagnetically coupled to the transmission path, the common path, the matching circuit, or the reception path.

Radio frequency module

A switch module includes a multilayer substrate including an antenna terminal, a ground terminal, and a high-frequency-side transmission signal terminal, as external connection terminals. A common-port-side circuit, a switch circuit, and a switching-port-side circuit are provided between the antenna terminal and the high-frequency-side transmission signal terminal. A first wiring portion connects a second inductor that defines a portion of the switching-port-side circuit to the high-frequency-side transmission signal terminal. When the multilayer substrate is viewed in plan, a first inductor, the second inductor, and via electrodes connected to the ground terminal are arranged between the first wiring portion, and second and third wiring portions and a capacitor which are connected to the antenna terminal.

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Nagaokakyo, Japan

Yukiteru Sugaya