Kabushiki Kaisha Shinkawa

Shinkawa Ltd.

Yukitaka Sonoda

Kanji Ozawa

Junichi Ide

Satoru Nagai

Koji Sato

A mounting apparatus bonds an electrode of an electronic component and an electrode of a substrate with thermally fusible bond metal to mount the component on a substrate. The apparatus includes a heater base that moves on a path to and from the substrate, a bonding tool, a pedestal to hold the electronic component by vacuum. The bonding tool is heated with a ceramic heater in the heater base to thermally bond the electronic component retained on the pedestal. The bonding tool includes a cooling flow passage providing communication between the upper surface and a side surface of the pedestal. This offers the advantage of shortening the time for cooling during mounting of the electronic component.

Electronic component mounting apparatus and the same method thereof

A bonding apparatus provided with a clamping device for holding a workpiece such as a tab tape, comprising an upper clamper and a lower clamper which are respectively divided into two sections. The upper and lower clampers are respectively mounted on an upper clamper holding plate and a lower clamper holding plate so that the gaps between facing surfaces of the respective sections of the clampers can be adjusted.

Clamping mechanism for a bonding apparatus

A suction adhesion-type holder used, for example, in a bonding machine including an air cooling device provided between a bonding stage and a vacuum pump that creates a vacuum suction in the bonding stage through the cooling device. Air suction holes formed in the bonding stage, that has a heating element, are connected to the air cooling device via a pipe and air heated by the bonding stage is cooled in the air cooling device when the heated air flows in a spiral pipe installed inside the cooling device and then sucked into the vacuum pump. The spiral pipe is cooled by a fan.

Suction adhesion-type holder

Two parts to be bonded together, such as a circuit board and a chip, are brought into one-above-the-other relationship, and before bonding is performed, a detecting device with an upper opening and a lower opening is set between the two parts, and by the use of optical system that is lights which passes through the openings, a positional alignment between the two parts is performed by correcting any discrepancy between the two so that the two parts are properly set one on the other and accurate bonding is executed to the two parts.

Bonding method and apparatus therefor

A bonding head assembly including a retaining block having a vacuum suction hole or electromagnet on its concave surface formed on the undersurface, a central shaft loosely passing through the central hole of the retaining block and having a bonding tool at the lower end, an oscillating ball attached to the upper part of the central shaft. After the bonding tool is brought into in contact with a workpiece, vacuum suction or electromagnet is activated so that the oscillating ball is brought into a tight contact with the concave surface of the retaining block, thus securely retaining the oscillating ball in the retaining block and, as a result, setting the position of the central shaft and therefore the bonding tool.

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Tokyo, Japan

Yukitaka Sonoda