Tokyo Institute of Technology

Ngk Insulators, Inc.

Japan Science and Technology Agency

Ngk Adrec Co., Ltd.

Shiraishi Central Laboratories Co., Ltd.

Yukitaka Kato

Hiroki Takasu

Shinichi Miwa

Yoichi Murakami

Toshiharu Kinoshita

Masahiko Tajika

Iori Himoto

Naoto Uchiyama

Xiaohan Wang

Jun Kariya

A composite material including a covalent organic framework (COF) single crystal having a major axis length of larger than 120 μm or a COF polycrystal including a plurality of the single crystals, and at least one heat-storage compound. The heat-storage compound is a compound that generates heat or absorbs heat by adsorption to or desorption from the COF single crystal. Also, a heat dissipation/storage member containing the composite material as a heat storage/dissipation material a COF single crystal having a major axis length of larger than 120 μm, and a method for producing a COF single crystal by crystallizing COF raw material compounds via a solution containing an ionic liquid or an organic salt and an equilibrium adjusting agent to grow a COF single crystal.

Composite material including COF, heat dissipation/storage member, and method for producing said composite material, and COF single crystal and production method therefor

Provided are a chemical heat storage material having excellent cyclic durability and a method for producing the same. A chemical heat storage material includes: a surface layer formed of silica and/or calcium silicate; and calcium oxide particles with the surface layer.

Chemical heat storage material and method for producing same

A heat storage member including a substrate containing a SiC sintered body as a principal ingredient and a heat storage material configured to store and radiate heat by a reversible chemical reaction with a reaction medium or a heat storage material configured to store and radiate heat by physical adsorption to a reaction medium and physical desorption from a reaction medium. The substrate has a three-dimensional network structure including a skeleton having porosity of 1% or less. A void ratio of a void formed in the three-dimensional network structure of the substrate is ranging from 30 to 95%. The heat storage material is disposed at least in a part of a surface of the void in the three-dimensional network structure of the substrate.

Heat storage member

Growing community of inventors

Tokyo, Japan

Yukitaka Kato