Murata Manufacturing Co., Ltd.

Yukio Yamamoto

Yoshihito Otsubo

Yosuke Matsushita

Mitsutoshi Imamura

Hiroshi Kitada

A module () includes a substrate () having a first main surface () and including wiring, a first component () having a circuit surface (), mounted on the first main surface () such that the circuit surface () faces the first main surface (), and having a ground terminal () on the circuit surface (), a first sealing resin () disposed to cover the first main surface () and the first component (), and a heat dissipation portion () provided along an upper surface of the first sealing resin (). The wiring is connected to the ground terminal (), and the module further includes a heat conducting member () connecting the wiring and the heat dissipation portion ().

Module

A modules is provided in which an electronic component is disposed on a first main surface and each of a plurality of first connection terminals is disposed on a second main surface. Moreover, a second connection terminal is disposed on the second main surface. When a substrate is viewed in a direction perpendicular to the second main surface, the second connection terminal is larger in area than each of the first connection terminals. When the substrate is viewed in the direction perpendicular to the second main surface, the second connection terminal is disposed on a straight line connecting the first connection terminals. The second connection terminal serves to establish an electrical connection.

Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A moduleincludes an upper module including a substrate, a first component, and a sealing resin layer, and a lower module including an intermediate layer and a redistribution layer. The first component is connected to the redistribution layer with a columnar conductor interposed therebetween and provided in the intermediate layer, and both the first component and a second component are rewired by the redistribution layer. Since the intermediate layer is formed by using a frame-shaped substrate, the upper module and the lower module can be connected without necessarily a bump, so that it is possible to provide a module which has a fanout-type package-on-package structure and can be easily reduced in height.

Provided is a module which has a package-on-package structure including a redistribution layer and can be easily reduced in height. A module includes an upper module including a substrate, a first component, and a sealing resin layer, and a lower module including an intermediate layer and a redistribution layer. The first component is connected to the redistribution layer with a columnar conductor interposed therebetween and provided in the intermediate layer, and both the first component and a second component are rewired by the redistribution layer. By fixing a resin block containing the second component to a lower surface of the substrate by a fixing conductor, positional deviation of the second component can be prevented. Further, by polishing an upper surface of the resin block, it is possible to improve the flatness.

An electronic component achieves significantly improved adhesion strength between an external electrode and a substrate body and includes an insulative substrate body, at least one groove disposed in at least one main surface of the substrate body, at least one external electrode disposed on the at least one main surface of the substrate body, wherein a portion of the at least one external electrode is disposed in at least a portion of the groove.

Electronic component and method of mounting the same

A measured antenna and a measuring antenna are placed inside a radio anechoic container. On the basis of an aperture size D of the measured antenna, an aperture size d of the measuring antenna, and a wavelength &#x3bb; of a measurement frequency, a distance L between the measured antenna and the measuring antenna is set to a value in the range of (D+d)/(2&#x3bb;) to 2(D+d)/&#x3bb;. Thus, in the Fresnel region where the distance L is short, antenna characteristics of the measured antenna substantially the same as those in the Fraunhofer region where the distance L is long can be measured.

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Kyoto, Japan

Yukio Yamamoto