Sony Chemicals Corporation

Sony Corporation

Sony Chemical & Information Device Corporation

The Furukawa Electric Co., Ltd.

Yukio Yamada

Motohide Takeichi

Tomoyuki Ishimatsu

Masayuki Nakamura

Kazuaki Suzuki

Hiroyuki Hishinuma

Iwao Ichikawa

Junji Shinozaki

Norio Kawatani

Hiroyuki Fujihira

Masao Saito

Yasushi Akutsu

Naoki Kamaya

Akio Furukawa

Kazuki Isono

Hiroyuki Kumakura

Akinari Mori

Toshiyuki Yamauchi

Koichi Sakai

Yasuzo Tanaka

Norikazu Iwasaki

Hisaya Tamura

Yoshisada Okayasu

Nobumasa Sakurai

Takanori Maruichi

Yoji Ishikawa

Kaname Matsumoto

Junichi Iwasawa

Mikio Sakairi

Naoki Okayama

Renjiro Okano

Toshiyuki Matsumoto

Toyoji Yamazaki

Kaizo Tsukamoto

A method for producing a joined structure, containing: after placing an anisotropic conductive film in the predetermined manner, placing a wiring member containing a wiring plate formed thereon, where the wiring plate has a resist region in which the wiring plate is covered with a resist layer, and a second electrode region in which the wiring plate is not covered with the resist layer, so that the edge of the resist region at a boundary with the second electrode region comes above the chamfer part of the substrate; and heating and compressing the anisotropic conductive film from the side of the wiring member to melt and make the anisotropic conductive film flow into the side of the resist region to thereby cover the second electrode region with the anisotropic conductive film, so as to electrically connect the first electrode region and the second electrode region.

Joined structure and method for producing the same

When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode padson the surface thereof and with a passivation filmat the periphery of the electrode pads, and conductive particlesare metallically bonded to the electric pads. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.

Bumpless semiconductor device

A film-shaped adhesive application apparatus includes a supply reel retainer for mounting a film-shaped adhesive supply reel used to wind into a roll shape a film-shaped adhesivecomprising a base film and an adhesive layer formed thereon, thermocompression bonding means for thermocompression-bonding the film-shaped adhesive drawn from the film-shaped adhesive supply reel to an adherend, and a winding reel retainer for mounting a winding reel used to wind the base film of the thermocompression-bonded film-shaped adhesive, and further temperature control means (thermal shield plate, cooler, or the like) for controlling the film-shaped adhesive supply reel mounted on the supply reel retainer at a prescribed temperature.

Film-shaped adhesive application apparatus

A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The first resin coating being softer than the resin particle. A second conductive thin film is disposed therearound. When the surface part of an electrode of an adherend that is to be connected is hard, a first resin coating of the conductive particle and the second conductive thin film are destroyed by pressure to bring the second conductive thin film in contact with the electrode and a metal wiring. If the surface part of the electrode is soft, the second conductive thin film on the surface side comes in contact with the electrode, which makes it possible for the particle to be used regardless of the surface state of an adherend.

Conductive particle and adhesive agent

An image pickup apparatus is provided. The image pickup apparatus permitting a conversion lens to be mounted and dismounted, wherein a lens hood is composed of a base portion on the mounting side and a tubular portion on the front side, the base portion and the tubular portion are detachably coupled to each other, and another lens is contained in the inside of the lens hood when the another lens is mounted on the front side of an optical system, whereby even when the conversion lens is being used, the lens hood can be used as it is, and the incident light contracting function of the lens hood can be maintained.

Image pickup apparatus

When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode padson the surface thereof and with a passivation filmat the periphery of the electrode pads, and conductive particlesare metallically bonded to the electric pads. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particlesThis bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.

A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process for mounting a semiconductor device by electrically connecting an electrode of the semiconductor device to an electrode of a wiring board by using an anisotropic conductive adhesive film having conductive particles dispersed in an insulating adhesive, which process comprising: the step of tentatively thermocompression bonding a conductive particle-free filmy insulating adhesive onto a wiring board to thereby form an insulating adhesive layer ; the step of forming a concave of a predetermined size in said insulating adhesive layer by using a compression bonding head provided with a pressing chip at a predetermined position; the step of putting in the concave of said insulating adhesive layer an anisotropic conductive adhesive film of a predetermined size; and the step of mounting a predetermined IC chip at a predetermined position of the compression bonding head and then positioning said IC chip and thermocompression bonding to said wiring board

Process for mounting semiconductor device and mounting apparatus

The present invention provides an adhesive film for producing an electric device having high reliability. Release agent layer of release film of the present invention is based on a fluorine compound with no silicone oil so that the adhesive force between substrate and release agent layer is enough high to provide an electric device having high reliability wherein release agent layer is not adhered when release film is separated from adhesive layer. The surface roughness of substrate of 3 &mgr;m or less limits irregularities on the side of adhesive layer from which release film has been separated and therefore, no bubbles occur between adhesive layer and semiconductor chip when semiconductor chip is pressed against adhesive layer. If the surface roughness of substrate is 1 &mgr;m or more, adhesive film also has high slitting performance.

Release films and adhesive films using the release films

A particle material for anisotropic conductive connection, is comprised of a conductive particle and an insulating resin layer covering the surface thereof, wherein the insulating resin layer includes an insulating gelled resin with a gel proportion of at least 90%. The particle material can be manufactured by fixing an insulating gelled resin powder with a gel proportion of at least 90% to the surface of the conductive particle by a physical/mechanical method to form the insulating resin layer.

Particle material anisotropic conductive connection and anisotropic conductive connection material

A method for mounting electronic elements, comprises the step of arranging a thermosetting adhesive between a circuit board, situated on a stage, and an electronic element to be connected with the wiring pattern of the circuit board, and then bonding the electronic element to the circuit board by the application of heat and pressure from the electronic element side. The electronic element is temporarily thermocompression-bonded to the circuit board such that the thermosetting reaction rate of the thermosetting adhesive on the side of the circuit board is lower than the thermosetting reaction rate on the side of the electronic element. The thermosetting adhesive is then set finally in order to bond the electronic element to the circuit board.

Method for mounting electronic elements

An anisotropically electroconductive connection body, in which two elements, each having electrodes on a confronting face, are connected with each other. The connection body is made up of a connecting material containing an adhesive component constituted mainly of a thermosetting resin, the connecting material being interposed between the two elements to be connected, and an extraneous portion of the connecting material protruding from the periphery of one of the elements on the other one of the elements, wherein the degree of hardening of the thermosetting resin in the connecting material in the extraneous portion is at least 60%.

Anisotropically electroconductive connection body and method for forming it

A process for mounting a semiconductor device whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process for mounting a semiconductor by electrically connecting an electrode of an IC chip to an electrode of a wiring board by using an anisotropic conductive adhesive film having conductive particles dispersed in an insulating adhesive, which process involves: the step of tentatively thermocompression bonding an insulating adhesive layer free from conductive particle onto the wiring board and then forming a concave of a definite size in the insulating adhesive layer ; and the step of putting in the concave of the insulating adhesive layer an anisotropic conductive adhesive film and then putting an IC chip into the concave followed by positioning and thermocompression bonding.

Process for mounting semiconductor device

Substrate warpage is eliminated without adversely affecting connection reliability when an IC chip or other packaging component is mounted on a substrate by thermocompression bonding with an interposed thermosetting adhesive. In a packaging method for the thermocompression bonding of a substrate and an IC chip or other packaging component between a stage and a head by means of an interposed thermosetting adhesive, the temperature of the stage during thermocompression bonding is set above the temperature corresponding to the inflection point of the elastic modulus in the relationship between the elastic modulus and the temperature of the cured adhesive.

Growing community of inventors

Kanuma, Japan

Yukio Yamada