Mitsubishi Gas Chemical Company, Inc.

Yukio Sasaki

Akitoshi Sugio

Masanobu Masu

Eiichi Yonemitsu

Takao Kawaki

Masao Okabe

Zenpei Mizutani

Kozo Ishiyama

Hiroshi Nakai

A polyphenylene ether resin composition having improved heat stability and good color, said composition comprising a polyphenylene ether resin matrix, and dispersed therein, a diphosphonite of the formula ##STR1## wherein R.sub.1 groups are identical or different and each represents a linear or branched alkyl group having 1 to 10 carbon atoms.

Polyphenylene ether resin composition having improved heat stability

An improved method for dispersing an inorganic pigment uniformly in polyphenylene ether resins. A polyphenylene ether composition having an inorganic pigment uniformly dispersed therein is obtained by intimately mixing a polyphenylene ether resin and the inorganic pigment in a weight ratio of from 0.5:1 to 2:1 by a high-speed mixer to form a pre-blend, and then mixing the pre-blend intimately with a polyphenylene ether in a conventional mixer such as an extruder. The pre-blend can also be uniformly dispersed in a mixture of the polyphenylene ether with polystyrene, a styrene/butadiene copolymer, a styrene/butadiene/acrylonitrile terpolymer, or a rubber-modified high impact polystyrene.

Process for producing polyphenylene ether composition containing

A high molecular resin composition having superior impact strength and processability and comprising a polymeric matrix containing polyphenylene ether and a minor proportion of a low-molecular-weight olefin oligomer dispersed therein.

High molecular resin composition

A resin composition comprising (A) 5 to 95 parts by weight of a copolyphenylene ether derived from a mixture of 50 to 98 mole% of a 2,6-dialkylphenol and 2 to 50 mole% of a 2,3,6-trialkylphenol and (B) 5 to 95 parts by weight of a styrene resin. The composition has superior thermal resistance and oxidation stability under heat and satisfactory mechanical properties, and retains these desirable properties after heat-aging. The composition is suitable for preparation of molded articles.

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Tokyo, Japan

Yukio Sasaki