Tokyo Electron Limited

Yukio Sano

Masayuki Harashima

Hirokatsu Kobayashi

Eisuke Morisaki

Michikazu Nakamura

Wataru Machiyama

A film forming method of forming a silicon carbide film on a substrate to be processed includes: forming the silicon carbide film on the substrate to be processed by loading a holder that holds the substrate to be processed into a processing container of a film forming apparatus to place the holder on a stage, and supplying a raw material gas into the processing container; and removing a reaction product, which has been adhered to a part other than the substrate to be processed during the forming the silicon carbide film, by loading a plate-shaped member having at least a surface formed by pyrolytic carbon into the processing container to place the plate-shaped member on the stage, and supplying a fluorine-containing gas into the processing container.

Film forming method and film forming apparatus

A cleaning method of cleaning a film-forming device, which includes a processing container having a substrate holder provided in the processing container so as to hold a SiC substrate, and which supplies a source gas to the processing container, an interior of which is depressurized, and heats the SiC substrate so as to perform a film formation on the SiC substrate, includes: a reaction product removal process of removing a reaction product, which is formed during the film formation and attached to portions other than the SiC substrate, by supplying a ClFgas into the processing container after the film formation; and a residue removal process of removing a substance, which remains after the reaction product removal process and serves as an unnecessary impurity or causes a defect during a subsequent film formation, by supplying air into the processing container.

Film-forming device and method for cleaning same

Wafer holder for manufacturing semiconductor

Growing community of inventors

Nirasaki, Japan

Yukio Sano