Murata Manufacturing Co., Ltd.

Yukio Sanada

Yasuhiro Nishisaka

Koji Sato

Shinichiro Kuroiwa

Seiichi Matsumoto

Masaki Fujiyama

Kunihiko Hamada

Kosuke Onishi

Seiji Koga

Tetsuya Kisumi

Toshiki Nagamoto

Masaki Hirota

Akira Otani

Hiromasa Takahashi

Kyoumi Tsukida

Makoto Ogawa

Masato Kimura

Akira Ishizuka

Yoshinori Saito

Kenichi Hayashi

Masayuki Taniguchi

Mika Yamamoto

Shuji Mushimoto, Deceased

Takeshi Ohkura

Hirokazu Naito

A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t&#x2266;t&#x2266;(&#x2156;)tis satisfied, where to is the thickness of each of the first and second external electrodes and tis the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

Ceramic electronic component

A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film.

Ceramic electronic component and method for manufacturing the same

A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal.

Ceramic electronic component and method for producing the same

A ceramic electronic component includes a ceramic body; a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a coating layer covering a surface portion of the ceramic body on which the internal electrodes are exposed, the coating layer being made of a glass or resin medium in which metal powder particles are dispersed; and an electrode terminal provided directly on the coating layer and including a plating film. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal and have an elongated shape in cross section along a thickness direction of the coating layer. The metal powder particles defining the conduction paths have a maximum diameter not smaller than the thickness of the coating layer.

Ceramic electronic component including coating layer

A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal.

Ceramic electronic component including glass coating layer

A method of manufacturing a ceramic electronic component prevents variations in characteristics even when the ceramic electronic component is embedded in a wiring board. Ceramic green sheets containing an organic binder having a degree of polymerization in a range from about 1000 to about 1500 are prepared. A first conductive paste layer is formed on a surface of each of the ceramic green sheets. The ceramic green sheets are laminated to form a raw ceramic laminated body. A second conductive paste layer is formed on a surface of the raw ceramic laminated body. The raw ceramic laminated body formed with the second conductive paste layer is fired.

Method of manufacturing ceramic electronic component, ceramic electronic component, and wiring board

Method of manufacturing a ceramic electronic component

A ceramic electronic component includes a ceramic base, first and second internal electrodes, and first and second external electrodes. The first external electrode is disposed at a first end portion of a first major surface in the longitudinal direction. The second external electrode is disposed at a second end portion of the first major surface in the longitudinal direction. A portion of each of the first and second external electrodes is opposed in the thickness direction to a region where the first and second internal electrodes are opposed to each other in the thickness direction. A condition ( 1/10)t&#x2266;t&#x2266;(&#x2156;)tis satisfied, where tis the thickness of each of the first and second external electrodes and tis the thickness of a portion in which each of the first and second external electrodes is embedded in the first major surface.

A ceramic electronic component includes a ceramic element body having a substantially rectangular parallelepiped shape, and first and second external electrodes. The first and second external electrodes are provided on a first principal surface. Portions of the first and second external electrodes project further than the other portions in a thickness direction. A projecting portion of the first external electrode is provided at one end of the first external electrode in a length direction and a second projecting portion of the second external electrode is provided at another end of the second external electrode in the length direction. Thus, a concave portion is provided between the projecting portions, and a portion of the first principal surface provided between the first and second external electrodes is exposed.

Ceramic electronic component and wiring board

A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56&#x2266;A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.

Method for manufacturing multilayer ceramic electronic component

A ceramic electronic component includes a ceramic body having a substantially rectangular parallelpiped shape. The ceramic body includes a central portion in which first and second internal electrodes are arranged, and first and second end portions in which the first and second internal electrodes are not arranged. The ceramic electronic component satisfies Expressions (1) and (2) below:W1&#x3e;T&#x2003;&#x2003;(1)W2&#x3e;T&#x2003;&#x2003;(2)where T denotes the dimension of the ceramic body in a thickness direction, Wdenotes the dimension of the first end portion in a width direction, and Wdenotes the dimension of the second end portion in the width direction.

A monolithic ceramic electronic component includes a first internal electrode including a first region extending to a first end surface and having a relatively large dimension in a width direction and a second region located at the side closer to a front end than is the first region and having a relatively small dimension in a width direction, wherein d&#x3e;c+ng (n represents a constant based on the size of the monolithic ceramic electronic component) is satisfied, where the distance from a first end point which is closest in the first region to the first side surface and which is closest to the second end surface to the second end surface is d, the distance between first and second wraparound portions is g, and the distance between a front end of the second wraparound portion and the second end surface is c

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Nagaokakyo, Japan

Yukio Sanada