Hitachi, Ltd.

Hitachi Automotive Systems, Ltd.

Hitachi-Lg Data Storage, Inc.

Yukio Sakigawa

Toshiaki Takai

Shohei Hata

Satoshi Arai

Hiroshi Ogasawara

Naoki Matsushima

Shigeharu Tsunoda

Hiroaki Furuichi

Masaru Kamoshida

Tatsuya Yamasaki

Kenji Watabe

Shirou Oouchi

Fumihito Ichikawa

Masayuki Okamura

It is provided an electronic control device including a resin molded body, a metal body, and an electronic component, wherein the resin molded body and a main surface of the metal body are bonded, and at least a part of a side surface continuous to the main surface of the metal body is in contact with a side contact portion provided in the resin molded body.

Electronic control device and method for manufacturing electronic control device

An optical module having a high-moisture-proof package structure in which dew condensation does not occur is provided. An optical module includes optical components including a light source, a pedestal on which the optical components are mounted, a cover which is combined to the pedestal to seal the optical components, and an emitting window disposed in the cover to take light from the light source outside. The pedestal and the cover are sealed with an O ring and a liquid seal material such that a compression direction of the O ring and a compression direction of the liquid seal material are almost perpendicular to each other.

Sealing of optical module with O-ring and liquid resin

The invention provides a wafer-bonded semiconductor device wherein warpage generated when wafers are bonded is reduced at a low cost ad through a simple process. In a method for manufacturing a wafer-bonded semiconductor device by bonding a first wafer substrate and a second wafer substrate together, the method of the invention includes a first step of forming in advance bonding members having a bonding function when heated on the wafer-bonded surface sides of the first wafer substrate and the second wafer substrate, respectively; a second step of supplying flux paste containing two or more kinds of powdery materials having reactivity to the surfaces of the bonding members formed in the first step; and a third step of causing excitation to have the flux paste supplied in the second step start reacting.

Method for manufacturing wafer-bonded semiconductor device

An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elementsand light-receiving elementsare mounted on an optical-element mounting substrate, a light-absorbing resinto absorb light with a light-emission wavelength of the light-emitting elementsis arranged to cover side surfaces of the light-emitting elementsand a non-adhesive layerincluding a material not adhesive to the light-absorbing resinis arranged between the light-absorbing resinand the optical-element mounting substrate

Optical module

There are provided a downsized and low-cost optical module used as a terminal for wavelength multiplexing optical transmission and one-core bidirectional optical transmission which transmits lights of plural wavelengths through one optical fiber, and a method of manufacturing the optical module. A base on which plural optical elements are mounted, and an optical multiplexer and demultiplexer having wavelength selection filters and mirrors formed on both surfaces of a substrate are prepared. Those two parts are packed into a package so that an optical element mounted surface and a filter surface are substantially parallel to each other, and the optical elements are arranged to emit or receive lights obliquely to the base. With this configuration, because the optical multiplexer and demultiplexer can be mounted in parallel to an X-Y plane, a package can be easily machined by using a lathe, thereby enabling a reduction in the costs.

Optical transceiver module

A filter element includes a first glass substrate having a pair of parallel surfaces and a band pass filter arranged on one of the parallel surfaces, a pair of single-crystal substrates (Si wafers) each including a primary surface formed with a depression having an inclined surface with respect to the primary surface occupying at least one half of the opening of the depression, and a second glass substrate having an optical element. The primary surfaces of the single-crystal substrate pair are bonded to a pair of the surfaces of the glass substrate. The depressions are faced through the glass substrate and surround the band pass filter. By this configuration, the filter element can be mass produced with a high accuracy and a low cost by the wafer-level process.

Growing community of inventors

Fujisawa, Japan

Yukio Sakigawa