Fujitsu Corporation

Yukio Ozaki

Toshinori Kasuga

Taizan Kobayashi

Yasuyuki Masuda

Kazuyuki Ikura

Jun Matsueda

Hidehiko Kira

Hirofumi Ohsawa

Kenji Kobae

Norio Kainuma

Shuichi Takeuchi

Kimio Nakamura

Masanori Fukushi

Tohru Harada

Kuniko Ishikawa

Eiji Takada

Seiji Kino

Provided is a non-transitory computer-readable storage medium storing a program for causing a computer to execute a process, the process including: acquiring transfer times of straight transfer paths for a hand of a vertical articulated robot having at least four controlled axes; calculating a vector of each of the straight transfer paths; comparing a direction of a vector of a target path for which a transfer time is to be estimated with a direction of the vector of each of the straight transfer paths, and identifying, among the straight transfer paths, a transfer path most similar in vector direction to the target path; and estimating a transfer time of the target path, in accordance with a scalar quantity of a vector of an identified transfer path, a scalar quantity of the vector of the target path, and a transfer time of the identified transfer path.

Non-transitory computer-readable storage medium, robot transfer time estimation method, and robot transfer time estimation device

An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Ultrasonic bonding apparatus

An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

A resonatorof the present invention includes: a vibrating memberholding an electronic componentand applying a vibration to the electronic component; and a depressing memberapplying a depressing force for a side of a substrateto the electronic componentthrough the vibrating member. The depressing memberincludes: leg portionswhich are disposed so as to leave spaces between the leg portions and both side facesof the vibrating memberparallel with a vibration direction A; and supporting portionsthrough which the leg portionsand the side facesof the vibrating memberare to be coupled to each other. With respect to a size of a cross section of each of the supporting portionsparallel with the side faceof the vibrating member, a length Lalong the vibration direction A of the vibrating memberis shorter than a length Lalong a depressing direction B of the depressing member

Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus

A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.

Method of manufacturing a semiconductor device

An ultrasonic tool, for bonding two materials to each other by joining a face of one of the materials to a face of the other material using the action of ultrasonic waves applied to one of the materials through another face of the one of the materials, wherein the ultrasonic tool has a coating layer comprising chromium oxide as a main component formed on at least the surface of the tool that is in contact with the face of the one of the materials through which the ultrasonic waves are applied to the one of the materials. An ultrasonic bonder provided with the ultrasonic tool is also disclosed.

Ultrasonic tool and ultrasonic bonder

A vibration extraction processing unit extracts a deflection component synchronous with a rotation from a clock signal of a non-contact sensor so as to correct a clock jitter. A clock generating unit generates a clock signal of any format frequency preliminarily set up according to the clock signal from the vibration extraction processing unit. A sector correction processing unit measures an error due to the frequency deflection so as to correct the writing start position for the format pattern signal of each sector containing a servo frame signal stored in a memory according to the measured error. Writing processing units read out the corrected format pattern signal from the memory according to a synchronous signal corresponding to a single turn of a disc and a format frequency clock signal and then writes into a disc medium face.

Servo track writing device and method thereof

An oscillating apparatus includes a driver generating a waveform signal based on a stored data for specifying a waveform so as to output the waveform signal to a transducer. A detector detects a phase difference between electric voltage and current supplied to the transducer. A memory unit holds gain data reflecting a characteristic of the transducer. The gain data specify gains corresponding to respective phase differences. An arithmetic unit calculates the frequency of the waveform based on the phase difference detected at the detector and a gain included in the gain data. The oscillating apparatus enables determination of a gain suitable to the transducer in view of the characteristic of the transducer. The frequency of the waveform signal is allowed to follow the change in the resonant frequency in a shorter period. The oscillation can thus be kept well.

Oscillating apparatus

A servo track writer for writing a servo track signal to a disk medium in a disk drive including the disk medium, a head for reading/writing information from/to the disk medium, and an internal actuator for moving the head across tracks formed on the disk medium. The internal actuator has a rotatable carriage for supporting the head. The servo track writer includes an external actuator having an arm, a solid deformation element provided in relation to the arm, and an effector mounted on the arm; an internal actuator control unit for controlling the internal actuator; an external actuator control unit for controlling the external actuator; a solid deformation element control unit for controlling the solid deformation element; and an arm position detecting device for detecting a position of the arm. The solid deformation element is divided into a first segment functioning as an actuator for minutely displacing the carriage, and a second segment functioning as a sensor for detecting a position of the effector.

Growing community of inventors

Kawasaki, Japan

Yukio Ozaki