Mitsubishi Denki Kabushiki Kaisha

Taiyo Yuden Co., Ltd.

Hitachi High-tech Corporation

Fdk Corporation

Yukio Ono

Hiroya Shigemoto

Seiichiro Kikuyama

Hironori Kawahara

Tomohiro Shoji

Naoshi Itabashi

Masatoshi Narahara

Norio Fukui

Sonoko Migitaka

Satoshi Takakuwa

Tomoki Onaka

Masaaki Saji

Kazuyoshi Takai

A charging device of the present invention includes a DC-DC converter, a charging circuit that charges a secondary battery, a power supply voltage detecting circuit that detects an input voltage Ve, an output voltage setting circuit that sets an output voltage of the DC-DC converter, and a charging control section that controls the charging circuit and the output voltage setting circuit based on the input voltage Ve, and the charging control section increases the output voltage of the DC-DC converter by a predetermined voltage in a stepwise manner while monitoring the input voltage Ve, and in a case where the input voltage Ve is decreased to a first threshold voltage Vthor less before the output voltage of the DC-DC converter increases to a rated charging voltage, the charging control section keeps the output voltage of the DC-DC converter at a voltage that is one step lower than a voltage at a time point of the case.

Charging device that can optimize charging current of a secondary battery

In order to reduce the cost of producing a spot array substrate and reduce the cost of nucleic acid polymer analysis, a spot array substrate is used which is produced by preparing a resin substratehaving a surface on which an uneven pattern is formed and a plurality of bead sitting positions set in a two-dimensional array within the uneven pattern, and loading surface-modified beads onto the bead sitting positions of the resin substrate.

Spot array substrate, method for producing same, and nucleic acid polymer analysis method and device

An electronic part is made from a laminated object including stacked abutting ceramic green sheets each carrying an electrically conductive paste having a contact portion in proximity to an edge of the sheet. The laminated object is fired to form a laminated body including ceramic insulator layers abutting electrically conductive internal electrode layers including contact segments in proximity to a side of the object. The body is then processed so the contact segments are exposed on the side of the object. Then an external electrode is formed on the polished body where the contact segment is exposed by using a dry process so the external electrode and the contact segment abut to establish an electric contact between the external electrode and the contact segments. The firing step causes the paste to move relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets. The processing step results in a reduction of the displacement of the contact segments relative to the edges of the sheets so the contact segments are displaced relative to the edges of the sheets by a distance to provide an anchoring effect for the external electrode when it is formed by the dry process.

Laminated electronic part having internal conducting region connected to an external contact and manufacturing method thereof

An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further includes an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.

Electronic device

An electronic device has an element assembly, in which electronic parts elements are disposed, and external electrodes of metal film which are formed on surfaces of the element assembly of the electronic device so as to extend and connect to the electronic parts elements, respectively. Further, in this electronic device, the external electrode is made up of an anchor layer adhered on the surface of the element assembly of the electronic device, a solder-resist layer formed to cover the anchor layer, and a solder-wettable layer formed to cover a surface of the solder-resistant layer and showing a superior wettability with respect to molten solder, in which the external electrode further comprises an intermediate layer provided between the solder-resistant layer and the solder-wettable layer and made of an alloy containing both metal materials forming the solder-resistant layer and the solder-wettable layer.

Electronic device and manufacturing method thereof

An operational amplifier and a digital signal transfer circuit in which an output voltage does not decrease instantly even if an abrupt change of input signal due to noise causes a high-to-low transition to be superposed on an input signal. The operational amplifier includes a differential pair of transistors with a first transistor having a collector that is grounded and a second transistor having an emitter connected to the emitter of the first transistor; a current mirror circuit with a third transistor having a collector connected to an output node of the differential pair of transistors and a fourth transistor having a base connected to a base of the third transistor; a fifth transistor having a collector connected to an output terminal and a base connected to an output node of the current mirror circuit; and a capacitive element connected between the output node of the current mirror circuit and the output terminal.

Operational amplifier and digital signal transfer circuit

A sensor drive circuit which accurately detects the amount of variation in inductance of a coil serving as a variable sensor. A peak detector circuit detects a peak value of a difference signal between a variable-amplitude signal and an intermediate signal to output a peak detection signal as a verification signal to a first input of an error amplifier. The error amplifier has a second input receiving a reference voltage and outputs a control signal to an AGC circuit on the basis of the result of comparison between the peak detection signal and the reference voltage. A peak detector circuit detects a peak value of a difference signal between the variable-amplitude signal and an inverted variable-amplitude signal to output the peak value as an inductance detection signal to the exterior. The AGC circuit performs automatic gain adjustment to output a signal of determined amplitude to a buffer in response to the control signal from the error amplifier.

Sensor drive circuit

There is disclosed a two-wire input/output device with an object of avoiding that communication becomes impossible when an abnormality occurs on one of two-wire LAN transmission lines. A pair of buses are separately controlled by driver circuits. An abnormality on a transmission line is detected by an abnormality detecting circuit with data supplied to terminals, and driving of only one of the driver circuits which corresponds to the bus having the abnormality is stopped by an output control circuit. When an abnormality occurs on one of the transmission lines, communication is enabled with a driver circuit corresponding to the transmission line having the abnormality being protected.

Growing community of inventors

Tokyo, Japan

Yukio Ono