Oki Electric Industry Co., Ltd.

Oki Data Corporation

Showa Denko Materials Co., Ltd.

Nordson Corporation

Kao Corporation

Topy Kogyo Kabushiki Kaisha

Riken Keiki Co., Ltd.

Nippon Steel Stainless Steel Corporation

Tohto Kasei Co., Ltd.

Oki Electric Industry, C., Ltd.

Hitachi Chemical Company, Ltd.

Resonac Corporation

Yukio Nakamura

Mitsuhiko Ogihara

Masumi Taninaka

Takatoku Shimizu

Hiroshi Hamano

Hiroshi Toyama

Kazuo Tokura

Masumi Koizumi

Takeshi Saitoh

Masaharu Nobori

Hiroshi Furuya

Ryohta Sasaki

Hiroshi Shimizu

Yuji Tosaka

Mio Chiba

Aya Yamanaka

Hiroyuki Fujiwara

Minoru Isobe

Makoto Ishimaru

Shintaro Hashimoto

Kentaro Oba

Mikio Furukawa

Ryoichi Uchimura

Takashi Ishizaki

Takeyuki Yanagibashi

Atsushi Takahashi

Katsuyuki Ito

Ichimatsu Abiko

Haruhiko Kondo

Hiromi Takahashi

Shinji Tsuchikawa

Tsutomu Nomoto

Shinji Tsuge

Yuichi Shimayama

Takao Kusano

Yukihiro Nishida

Takashi Ushikubo

Hideyasu Asakage

Yoshitaka Terao

Katsuzo Kaminishi

Hideo Sawai

Katsuhiko Nawate

Seiichi Otani

Hiroshi Tohyama

Shigemitsu Horikawa

Yuma Yoshida

Tokio Sato

Mamoru Furusato

Nobuhisa Saito

Kazutoshi Danjoubara

Nobuhisa Kawai

Hiroshi Todo

Etsuro Sugisaki

Masao Ikehata

Yoshiyuki Higashino

Yuuji Terouchi

Kengo Ohtaka

Mituhiko Ogihara

Yasuo Iguti

Junki Somekawa

Masatomo Kawa

Kenichiro Kusunoki

An alloy material is provided which contains elements including, in mass %, C: 0.010 to 0.10%, Si: more than 0.10% to 0.50% or less, Mn: 0.05 to 0.50%, Ni: 34.5 to 37.0%, and Nb: 0.001 to 1.0%, and which satisfies [T≤T-2], [C—Nb/7.7-Ta/15≤0.045], [Nb-7.7C≤0.30], and [Ta-15C≤0.30]. Where, each symbol of an element in the above formulas represents a content (mass %) of the corresponding element, Trepresents a Curie temperature (° C.) of the alloy material, and Trepresents a Curie temperature (° C.) of the alloy material after the alloy material is held at 900° C. for one minute and thereafter is cooled under conditions such that an average cooling rate in a temperature range from 600 to 300° C. is 0.2° C./s.

Alloy material and method for producing same

Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.0.12&#x3c;{(1+2)/2}/&#x2003;&#x2003;(1)0.8&#x2264;1/2&#x2264;1.25&#x2003;&#x2003;(2)

Metal-clad laminate, printed wiring board and semiconductor package

In the method for adhering a resin film with an aggregate under an atmospheric pressure in which workability is excellent and spouting of the resin from an edge portion of the aggregate can be suppressed, the present invention provides a method for producing an FRP precursor with excellent resin filling property into bulk voids of the aggregate as well as a method for producing an FRP. Specifically, provided is the method for producing the FRP precursor by adhering a thermosetting resin film to one surface of an aggregate that is in a form of a sheet under an atmospheric pressure, wherein the method includes a process in which the thermosetting resin film and the aggregate are press-adhered by heating by means of a pressure roll having a temperature in a range of +5&#xb0; C. to +35&#xb0; C. relative to a temperature at which a minimum melt viscosity of the film is exhibited.

Method for manufacturing FRP precursor and method for manufacturing FRP

The present invention relates to a prepreg including a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a second resin layer formed on the other surface of the fiber base material layer, wherein the first resin layer is a layer obtained through layer formation of a resin composition (I) containing, as a main component of resin components, an epoxy resin (A), and the second resin layer is a layer obtained through layer formation of a resin composition (II) containing, as a main component of resin components, an amine compound (B) having at least two primary amino groups in one molecule thereof and a maleimide compound (C) having at least two N-substituted maleimide groups in one molecule thereof; a laminated sheet obtained by using the prepreg; a printed wiring board; a coreless board; a semiconductor package; and a method of producing a coreless board.

Prepreg, laminate, printed wiring board, coreless substrate, semiconductor package and method for producing coreless substrate

Provided are a printed circuit board in which warps are effectively suppressed, and a semiconductor package having a semiconductor device mounted on said printed circuit board, even though circuit patterns of different amounts of metal are formed on both sides of one cured product of a prepreg. Specifically, said printed circuit board is a printed circuit board which comprises a cured product of a prepreg comprising a fiber base material and a resin composition, in which circuit patterns of different amounts of metal are formed on both sides of one cured product of the prepreg, in which said prepreg has layers on the front and back of said fiber base material, wherein said layers comprise resin compositions having different heat curing shrinkage rates, in which among these layers, the layer made of the resin composition having a smaller heat curing shrinkage rate is present on the side on which the circuit pattern with a smaller amount of metal is formed.

Printed wiring board and semiconductor package

Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.

Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board

An object of the present invention is to provide a jig that does not require an operator to hold a lock ring against the elastic repulsion force of the lock ring that attempts to contract in a radial direction when the lock ring is attached to a rim base, the jig that is safe because there is no need for the operator to support the weight of the lock ring and can maintain a state in which, when the space between the ends of the lock ring is increased, the inside diameter side of the lock ring is a perfect circle or is close to a perfect circle. Thus, a lock ring mounting/demounting jig of the present invention is formed of a pair of jigs, the pair of jigs can be attached at both ends () of a lock ring () and on the radial outside of the lock ring (), and the angle formed by the direction in which the space between the pair of jigs expands and contracts and the longitudinal direction of each jig is changeable.

Lock ring mounting/demounting jig

An information display apparatus includes a matrix of thin-film light-emitting diodes (LEDs) disposed on a transparent substrate. The thin-film LEDs are epitaxially grown on a semiconductor substrate, then transferred in strips to the transparent substrate, anchored by intermolecular forces, and separated into individual LEDs by photolithography and etching. The anodes and cathodes of the thin-film LEDs are connected to anode and cathode driving circuits by a matrix of thin-film electrical paths formed on the transparent substrate. The matrix of LEDs and interconnections is dense enough to display images of high quality, and provides enough pixels for the display of useful text and graphics on even small information display devices.

Information display apparatus having a plurality of thin-film light-emitting diodes

A light source apparatus emits light image information. A reflective layer is formed on a planarization film formed on a metal substrate. LED thin films are arranged in a matrix having columns extending in first directions and rows extending in second directions perpendicular to the first directions, the LED thin films being bonded to the reflective layer by means of intermolecular force. First wires are connected to first electrodes of the LED thin films. Second wires are connected to second electrodes of the LED thin films. A first driver circuit selectively electrically drives the LED thin films, arranged in the rows, via the plurality of first wires. A second driver circuit selectively electrically drives the LED thin films, arranged in the rows, via the plurality of second wires.

Light source apparatus and head-up display apparatus incorporating the light source apparatus

It is an object of the present invention to provide a multi-piece rim which does not need much labor for supporting, and does not increase the number of components to be managed and the number of needed tasks. The present invention constructs a lock ring () to be fitted in the groove () of a gutter band (), which ring is divided in a plurality of portions () being coupled at each end () thereof by a flexible coupling member (). Alternatively, a lock ring () is formed into a substantially C-shape being manufactured by cutting a part of a circular ring, and comprises a first portion () wherein a length of a chord at the cut portion is substantially equal to the diametral of a hub, and a second portion () having a shape corresponding to the cut portion of a circular ring in the first portion.

Multi-piece rim and its attaching/removing method

A backlight device includes a first substrate having optical transparency and having first and second surfaces opposite to each other. An LED thin-film is fixed to the first surface of the first substrate. An anode electrode and a cathode electrode are formed on the LED thin-film. An anode driver IC and a cathode driver IC are provided for driving the LED thin-film to emit light. An anode wiring and a cathode wiring are provided on the first surface of the first substrate. A second substrate has optical transparency, and has first and second surfaces opposite to each other. The second surface of the second substrate faces the first surface of the first substrate. A reflection film is provided on the first surface of the second substrate. A light diffusion plate is provided so as to face the second surface of the first substrate and has a function to diffuse incident light.

LED backlight device and LCD device

A backlight device includes a first substrate having optical transparency and having a first surface and a second surface. An LED thin-film is fixed to the first surface of the first substrate. The LED thin-film is formed of epitaxially grown inorganic material layers as a P-N junction device. An anode electrode and a cathode electrode are formed on the LED thin-film. An anode driver IC and a cathode driver IC are provided for driving the LED thin-film. An anode wiring is provided for connecting the anode driver IC and the anode electrode, and a cathode wiring is provided for connecting the cathode driver IC and the cathode electrode. A second substrate has optical transparency and having a function to diffuse incident light. The second substrate is provided so as to face the second surface of the first substrate.

A projection display apparatus includes an image forming section that forms an image based on image information received from an external device, and a projection lens that projects the image formed by the image forming section. The projection display apparatus includes a substrate, a plurality of light emitting elements, a first driver and a second driver. The light emitting elements are two-dimensionally arranged on the substrate. The light emitting elements include rows of light emitting elements and columns of light emitting elements such that the rows are substantially perpendicular to the columns. The first driver element selectively drives the rows. The second driver element selectively drives the columns. The plurality of light emitting elements include three groups of light emitting elements aligned either in the rows or in the columns, each group emitting light of a different wavelength from the remaining groups.

Projection display apparatus and image forming apparatus with efficient power consumption

An LED backlight device includes a substrate having an optical transparency and an LED thin-film layered structure fixed to a first surface of the substrate. The LED thin-film layered structure is formed of epitaxially grown inorganic material layers as a P-N junction device. An anode electrode and a cathode electrode are formed on the LED thin-film layered structure. An anode driver IC and a cathode driver IC are provided for driving the LED thin-film layered structure. A wiring structure electrically connects the anode driver IC and the anode electrode of the LED thin-film layered structure and electrically connects the cathode driver IC and the cathode electrode of the LED thin-film layered structure. A phosphor is formed on the second surface of the substrate opposite to the first surface.

A backlight device includes a first substrate, and an LED thin-film layered structure (epitaxially grown inorganic material layers) fixed to a surface of the first substrate. An anode electrode and a cathode electrode are formed on the LED thin-film layered structure. An anode driver IC and a cathode driver IC are provided for driving the LED thin-film layered structure. A wiring structure electrically connects the anode driver IC and the anode electrode of the LED thin-film layered structure, and electrically connects the cathode driver IC and the cathode electrode of the LED thin-film layered structure. A second substrate has an optical transparency and is disposed to face the surface of the first substrate on which the LED thin-film layered structure is formed. A phosphor is formed on a surface of the second substrate facing the first substrate and is disposed on a position corresponding to the LED thin-film layered structure.

Growing community of inventors

Tokyo, Japan

Yukio Nakamura