Kabushiki Kaisha Toyota Chuo Kenkyusho

Toyota Jidosha Kabushiki Kaisha

Yukio Miyachi

Hideo Hasegawa

Hiroyuki Mori

Kazuyuki Nakanishi

Hideo Tachikawa

Yasushi Yamada

Hiroyuki Ueda

Tadashi Oshima

Hiroshi Osada

Atsuto Okamoto

Kiyofumi Nakajima

Masayasu Ishiko

A semiconductor apparatusincludes a radiatoron which plural semiconductor modulesthat include semiconductor elementsare mounted, the semiconductor apparatuscharacterized by the radiatorincluding a first main surfaceB and a second main surfaceC configured to be located on the opposite side of the first main surfaceB. Semiconductor module mount-surfacesBBCCare arranged in the first main surfaceB and the second main surfaceC in a zigzag pattern in cross-sectional view; and the semiconductor modulesare mounted onto some or all of the semiconductor module mount-surfacesBBCC

Semiconductor device with a zigzag radiator

A semiconductor element heat dissipating member is provided which has excellent heat dissipation characteristics and adhesion characteristics and enables production of a semiconductor device at a low cost. A semiconductor device using the same, and a method of producing the same are also provided. The semiconductor element heat dissipating member has a conductive substrate and an electrically insulating amorphous carbon film containing hydrogen, and the electrically insulating amorphous carbon film is formed at least on a region of the conductive substrate on which region a semiconductor element is to be mounted.

Semiconductor element heat dissipating member, semiconductor device using same, and method for manufacturing same

In a pressure-welded semiconductor device where at least one semiconductor element is disposed inside a casing, a buffer conductive layer including conductive carbons is disposed at pressure-welded portions between first casing-side electrodes and element-side electrodes disposed on a first main surface and at pressure-welded portions between second casing-side electrodes and element-side electrodes disposed on a second main surface.

Pressure-welded semiconductor device

Growing community of inventors

Owariasahi, Japan

Yukio Miyachi