Matsushita Electric Industrial Co., Ltd.

Yukio Maeda

Kenichiro Suetsugu

Takao Inoue

Mikiya Nakata

Shunji Hibino

Junji Ikeda

Tokuhito Hamane

Tetsuo Fukushima

Masami Uchida

Tamotsu Wakahata

Takashi Akiguchi

Shinichi Kudo

Shoshi Kabashima

Hiroaki Takano

Akira Kabeshita

Yoshifumi Kitayama

Keiji Saeki

Daisuke Irii

Yasuji Kawashima

Masuo Koshi

Keigo Momose

Shuichi Murakami

Tatsuo Okuji

Kenichiro Todoroki

Ikuo Niboshi

Shinichi Kudou

Flow soldering process and apparatus

A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Connection structure and electronic circuit board

There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.

Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering

An adhesive composition for use in the mounting of electronic parts on a printed circuit board is disclosed. The composition comprises a photosetting and thermosetting resin ingredient and a long-chain saturated fatty acid amide. Also disclosed is a method for mounting electronic parts on a printed circuit board by the use of such an adhesive composition.

Method for mounting electronic parts on a printed circuit board by use

An image reading device includes: a light emitting element for irradiating light on an image surface; a light receiving element for receiving image information in the form of reflected light from the image surface; and light waveguide passages provided between the light emitting element and the image surface and between the light receiving element and the image surface, respectively, and at least the light waveguide passage for the light emitting element is widened at an end surface thereof at the image surface to a width wider than at the end surface at the light emitting element.

Image reading device having a light waveguide means widened toward an

An adhesive composition comprising 10 to 60 parts by weight per 100 parts of the total weight of components (1) to (4) of a monofunctional (meth)acrylic monomer, 0.01 to 10 parts by weight per 100 parts of the total weight of components (1) to (4) of a compound having at least two (meth)acryloyl groups in a molecule, 30 to 80 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a heat resistant epoxy resin, 0.1 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of an imidazole compound, 0.001 to 10 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a photopolymerization initiator, and 0.01 to 20 parts by weight per 100 parts by weight of the total weight of components (1) to (4) of a thixotropic agent, with which an electronic part can be effectively packaged to a printed board.

Method for packaging electronic parts and adhesive for use in said method

Disclosed is an image sensor including a circuit board, an array of light emitting elements for emitting light to an image plane, an array of light receiving elements for receiving image information transmitted by reflected light from the image plane, and plural pairs of light wave guides interposed between the light emitting elements and the image plane and between the image plane and the light receiving elements. Both the light emitting elements and the light receiving elements are mounted on the same surface of the circuit board.

Image sensor having light guides for communication with image plane

An adhesive containing at least two main components, and which is capable of being gelled to make it pressure-sensitive, of being photopolymerized and of being thermally polymerized, is applied at selected positions on a printed circuit substrate on which electronic parts are to be loaded. Ultraviolet rays are irradiated on the adhesive, to gelate the adhesive thereby to realize the pressure-sensitive adhesion ability by reaction of a photopolymerization functional group of the adhesive. After loading the electronic parts on the adhesive, the adhesive is hardened by reaction of a thermal polymerization functional group by heating. Thereafter, electrodes of the electronic parts and conductive lands of the printed circuit substrate are soldered.

Method for mounting electronic parts

Method for forming thick film circuit using rotatable nozzle having wide

Method and apparatus for drawing a thick film circuit

A bonding method of semiconductor device by using a film carrier; A heat-resistive insulating layer is deposited all over the surface of a dummy wafer on which a photo-resist film having a predetermined pattern is previously formed; The photo-resist film is removed together with the heat-resistive insulating layer for forming openings; Bumps are formed on the openings by plating using the heat-resistive insulating layer as a mask; After transferring the bumps to inner leads, the bumps of the inner leads are bonded to bonding pads of the semiconductor element.

Bonding method of semiconductor device

Disclosed is a method for forming thick film circuits or the like to be used when forming elements such as conductors and resistors on a thick film circuit board. The method is performed with a writing head for storing paste to form patterns and which lowers and approaches an arbitrary point in close proximity to the board of a thick film circuit and while same state, moves laterally to another other arbitrary point along the surface of the board, and then ascends to be separated from the board. The paste in the writing head is pressurized to be forced out of the head before the writing head begins to move laterally such that the paste is immediately applied on the board when the writing head begins to move laterally. This pressurization of the paste is stopped before the writing head finishes its lateral movement, so that the extrusion of the paste may be stopped the moment the writing head finishes the lateral movement. As a result, blurring or blotting at the beginning and ending part of the pattern writing may be prevented, so that patterns may be formed at high speed and with high precision.

Method of forming thick film circuits

Method of manufacturing an optical recording/reproducing disc

A manufacturing method for an optical type recording and reproducing disc and the like, comprising the steps of, applying a coating liquid to opposite planar surfaces of the disc except for the central portions by rotating the disc, with the opposite planar surfaces of the disc being simultaneously dipped in the coating liquid, and thereafter, simultaneously curing the coating liquid applied to the opposite planar surfaces of the disc while rotating the disc.

Disc coating method

An alkaline galvanic cell including a container serving for a cathode terminal, a sealing plate in the form of a layered clad plate serving for an anode terminal to be fitted into the container, and an insulating packing provided between the sealing plate and container for sealing the cell upon assembly. The cell is provided with a layer of epoxy adduct polyamide amine having amine valence in the range of 50 to 400 and disposed between the innermost copper layer of the sealing plate arranged to be readily amalgamated and the insulating packing so as to serve as a sealing agent or liquid leakage suppression agent.

Growing community of inventors

Hirakata, Japan

Yukio Maeda