Hitachi, Ltd.

Hitachi-high-technologies Corporation

Hitachi Kenki Fine Tech Co., Ltd.

Hitachi High-tech Electronics Engineering Co., Ltd.

Hitachi High-technologies Corporaation

Yukio Kenbou

Minori Noguchi

Yoshikazu Tanabe

Kenji Watanabe

Hirofumi Tsuchiyama

Yasuo Yatsugake

Ichiro Ishimaru

Ichiro Moriyama

Hiroshi Kuroda

Takenori Hiroki

Takafumi Morimoto

Ken Murayama

Tooru Kurenuma

Shigeru Miwa

Yuuichi Kunitomo

Hiroaki Yanagimoto

Yoshiyuki Nagano

Tadashi Fujieda

Kishio Hidaka

Mitsuo Hayashibara

Yasushi Minomoto

Tooru Shinaki

Yoshiyuki Nag'No

A defect inspection apparatus including: a first illumination optical system which is configured to illuminate the inspection area on a sample surface from a normal line direction or a direction near thereof with respect to said sample surface; a second illumination optical system which is configured to illuminate said inspection area from a slant direction with respect to said sample surface; a detection optical system having a plurality of first detectors which are located, in front of, on the sides of, and behind said inspection area, respectively, with respect to the illumination direction of said second illumination optical system, and where the regular reflected light component, from said sample surface, by illumination light of said second illumination optical system, is not converged; and a signal processing system which is configured to inspect a defect, upon basis of signals obtained from said plurality of first detectors.

Surface inspection apparatus and method thereof

The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process.

An apparatus for detecting defects, including: a first illumination optical unit which illuminates from a normal direction or in the vicinity of the normal direction; a second illumination optical unit which illuminates from a first elevation angle; a first detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; a second detection optical unit which detects light reflected by the illumination of the first illumination optical unit or the second illumination optical unit with plural detectors; wherein the plural detectors of the first detection optical unit and the plural detectors of the second detection optical unit are photomultipliers, and the signal processor processes the signals outputted from the photomultipliers and are adjusted to balance in sensitivities.

A probe is made by attaching a carbon nanotubeto a mounting base end, which eliminates the effects of a carbon contamination film, to increase the bonding strength, increase the conductivity of the probe, and strengthen the bonding performance thereof by coating the entire circumference of the nanotube and the base with a coating film, rather than coating just one side. The work of mounting the carbon nanotube and mounting base end are performed under observation by a microscope. Further, the carbon contamination filmformed by an electron microscope is stripped off at a stage before bonding by the coating film.

Probe manufacturing method, probe, and scanning probe microscope

The probe tip movement control method of the scanning probe microscope is used for a scanning probe microscope provided with a cantileverhaving a probe tipfacing a sample. The atomic force occurring between the probe tip and sample is measured when the probe tip scans the surface of the sample. X-, Y-, and Z-fine movement mechanisms, andare used to relatively change the positions of the probe tip and sample. It is possible to maintain a high measurement accuracy and enable scan movement of a probe tip on a sample surface by simple control when measuring a part having a gradient in measurement of an uneven shape on a sample surface.

Scanning type probe microscope and probe moving control method therefor

A scanning probe microscope has a cantilever with a probe facing a sample and a measurement section for measuring a physical quantity occurring between the probe and the sample when the probe scans a surface of the sample, holding the physical quantity constant to measure the surface of the sample. The above microscope further has a probe tilt mechanism, an optical microscope etc. for detecting a position of the probe when the probe is tilted, and a control section for setting the probe in a first tilt posture and second tilt posture, measuring a surface of the sample by the measurement section at each tilt posture, detecting the position of the probe at least at the second tilt posture by the optical microscope etc., and making a measurement location at the second tilt posture match with a measurement location at the first tilt posture for measurement.

Scanning probe microscope and measurement method using the same

A surface inspection apparatus and a method for inspecting the surface of a sample are capable of inspecting discriminatingly between scratches of various configuration and adhered foreign objects that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to a polishing process such as CMP or a grinding process, in semiconductor manufacturing process or magnetic head manufacturing process. In the invention, the scratch and foreign object that occur on the polished or ground surface of the sample is epi-illuminated and slant-illuminated by use of approximately same light flux, the difference between the scattered light intensity from the shallow scratch and from the foreign object is applied to thereby discriminate between the shallow scratch and the foreign object, and the directionality of the scattered light is detected to discriminate between the linear scratch and the foreign object.

The invention provides a surface inspection apparatus and a method for inspecting the surface of a sample that are capable of inspecting discriminatingly between the scratch of various configuration and the adhered foreign object that occur on the surface of a work target when the work target (for example, an insulating film on a semiconductor substrate) is subjected to polishing process such as CMP or grinding process in semiconductor manufacturing process or magnetic head manufacturing process. In the invention, the scratch and foreign object that occur on the polished or ground surface of the sample is epi-illuminated and slant-illuminated by use of approximately same light flux, the difference between the scattered light intensity emitted from the shallow scratch and that from the foreign object when epi-illumination is applied and slant illumination is applied to thereby discriminate between the shallow scratch and the foreign object, and the directionality of the scattered light when the epi-illumination is applied and the slant illumination is applied is detected to thereby discriminate between the linear scratch and the foreign object.

Growing community of inventors

Tokyo, Japan

Yukio Kenbou