Hitachi Cable, Inc.

Hitachi Cable Fine-Tech, Ltd.

Yukio Ito

Hiroshi Okikawa

Hajime Nishi

Iku Higashidani

Hiroyuki Akutsu

Hiromitsu Kuroda

Yuju Endo

Hiroshi Bando

Ken Takahashi

Katsunori Sawahata

Kuniaki Kimoto

A solar cell lead includes a strip plate conductive material that a surface thereof is coated with solder plating. The coated solder plating includes a concavo-convex portion on a surface thereof and a 0.2% proof stress of not more than 90 MPa by a tensile test. The coated solder plating includes a hot-dip solder plating layer formed by supplying a molten solder on the surface of the strip plate conductive material. A plating temperature is set to be not higher than a liquidus-line temperature of the used solder plus 120&#xb0; C., and an oxide film on a surface of the hot-dip solder plating layer is set to be not more than 7 nm in thickness.

Solar cell lead, method of manufacturing the same, and solar cell using the same

A solar cell lead wire includes a strip-shaped conductive material formed by rolling a wire, and upper and lower melt solder-plated layers formed to be flat on upper and lower surfaces, respectively, of the strip-shaped conductive material by supplying melt solder thereto.

Solar cell lead wire and production method therefor and solar cell using same

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Hitachi, Japan

Yukio Ito