Fujitsu Corporation

Yukio Hosoda

Shinichiroh Ikemasu

Koichi Sugiyama

Masaaki Ichikawa

There are contained the steps of leaving selectively the first insulating film that covers respective gate electrodes in the first region and the second region and the semiconductor substrate on side surfaces of the second gate electrode by etching back the first insulating film only in the second region, forming the second insulating film that is formed of same material as the first insulating film in the first region and the second region, forming the third insulating film whose selective etching to the first insulating film can be performed, forming holes to expose the semiconductor substrate by etching the first to third insulating films between the gate electrode in the first region, forming plugs in the holes, forming the fourth insulating film to cover the plugs and the third insulating film, forming a plurality of holes in the first region and the second region by patterning the fourth insulating film to the second insulating film.

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

A semiconductor device comprises a plurality of wiring formed on a lower insulating film to be spaced apart from each other, dummy patterns formed on the lower insulating layer between the plurality of wiring and spaced apart from each other, and an upper insulating layer formed to cover the plurality of wiring and the dummy patterns and having therein cavities formed in regions between the plurality of wiring and the dummy patterns.

Method of manufacturing a semiconductor device having dummy patterns and

A semiconductor device comprises a plurality of wiring formed on a lower insulating film to be spaced apart from each other, dummy patterns formed on the lower insulating layer between the plurality of wiring and spaced apart from each other, and an upper insulating layer formed to cover the plurality of wiring and the dummy patterns and having cavities formed in regions between the plurality of wiring and the dummy patterns.

Growing community of inventors

Kawasaki, Japan

Yukio Hosoda