Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Nuvoton Technology Corporation Japan

Yukio Hayakawa

Takumi Mikawa

Yoshio Kawashima

Takeki Ninomiya

Atsushi Himeno

Shinichi Yoneda

Koji Arita

Haruyuki Sorada

Satoru Ito

Takeshi Takagi

Ryoko Miyanaga

Kiyotaka Tsuji

Hideaki Murase

Akifumi Kawahara

Ryutaro Yasuhara

Koichi Kawashima

In a non-volatile storage device, a first lower-layer metal wire, a lower plug, a variable resistance element, an upper plug, and a first upper-layer metal wire are formed in that order from below in a storage region, and a second lower-layer metal wire, a first via, a middle-layer metal wire, a second via, and a second upper-layer metal wire are formed in that order from below in a circuit region. The first and second lower-layer metal wires are formed in the same layer, and the first and second upper-layer metal wires are formed on the same layer. Relative to a substrate, the variable resistance element and the middle-layer metal wire have top faces at different heights, bottom faces at different heights, or both top faces and bottom faces at different heights.

Non-volatile storage device and method of manufacturing the same

A nonvolatile memory element including: a first electrode; a second electrode; a variable resistance layer that is between the first electrode and the second electrode and includes, as stacked layers, a first variable resistance layer connected to the first electrode and a second variable resistance layer connected to the second electrode; and a side wall protecting layer that has oxygen barrier properties and covers a side surface of the variable resistance layer. The first variable resistance layer includes a first metal oxide and a third metal oxide formed around the first metal oxide and having an oxygen deficiency lower than that of the first metal oxide, and the second variable resistance layer includes a second metal oxide having an oxygen deficiency lower than that of the first metal oxide.

Nonvolatile memory element, nonvolatile memory device, nonvolatile memory element manufacturing method, and nonvolatile memory device manufacturing method

A nonvolatile memory device includes an insulating layer, oxygen diffusion prevention layers disposed on the insulating layer, a plurality of contact plugs, each of the plurality of the contact plugs penetrating through each of the plurality of the oxygen diffusion prevention layers and at least a part of the insulating layer, and a plurality of resistance-variable elements, each of the plurality of the resistance-variable elements covering each of the plurality of the contact plugs exposed on surfaces of the oxygen diffusion prevention layers and being electrically connected to each of the plurality of the contact plugs Each of the oxygen diffusion prevention layers is provided only between the insulating layer and each of the plurality of the resistance-variable elements to correspond to each of the plurality of the contact plugs arranged for each of the plurality of the resistance-variable elements.

Nonvolatile memory device and method for manufacturing the same

A resistive nonvolatile storage device includes a first interlayer insulating layer provided above a substrate, a contact hole penetrating through the first interlayer insulating layer, a contact layer wholly covering a bottom surface and a sidewall surface of the contact hole and extending to at least partially cover an upper surface of the first interlayer insulating layer, a contact plug filled in the contact hole, an upper surface of the contact plug being positioned below an upper surface of the contact layer, a lower electrode provided on both the contact plug and the contact layer that is provided on the part of the upper surface of the first interlayer insulating layer, and a resistance change layer provided on the lower electrode, and an upper electrode that is provided on the resistance change layer.

Resistive nonvolatile storage device, manufacturing method for same, and resistive nonvolatile storage apparatus

A nonvolatile memory element according to the present invention includes a first metal line; a plug formed on the first metal line and connected to the first metal line; a stacked structure including a first electrode, a second electrode, and a variable resistance layer, the stacked structure being formed on a plug which is connected to the first electrode; a second metal line formed on the stacked structure and directly connected to the second electrode; and a side wall protective layer which covers the side wall of the stacked structure and has an insulating property and an oxygen barrier property, wherein part of a lower surface of the second metal line is located under an upper surface of the stacked structure.

Nonvolatile memory element, nonvolatile memory device, and manufacturing method for the same

A variable resistance nonvolatile storage element includes: a first electrode; a second electrode; and a variable resistance layer having a resistance value that reversibly changes based on an electrical signal applied between the electrodes, wherein the variable resistance layer has a structure formed by stacking a first transition metal oxide layer, a second transition metal oxide layer, and a third transition metal oxide layer in this order, the first transition metal oxide layer having a composition expressed as MO(where M is a transition metal and O is oxygen), the second transition metal oxide layer having a composition expressed as MO(where x&#x3e;y), and the third transition metal oxide layer having a composition expressed as MO(where y&#x3e;z).

Nonvolatile storage element and method for manufacturing same

A variable resistance layer between a first electrode and a second electrode includes: a first variable resistance layer contacting the first electrode; and a second variable resistance layer contacting the second electrode and having a lower degree of oxygen deficiency than the first variable resistance layer. A principal face of the first variable resistance layer which is close to the second variable resistance layer is flat. The second variable resistance layer is in contact with both the first variable resistance layer and the second electrode in a polygonal region including a vertex inward of an outline of the variable resistance layer and vertices along the outline when seen from a direction perpendicular to the principal face of the variable resistance layer, and is not in contact with at least one of the first variable resistance layer and the second electrode in a region outside the region inside the polygon.

Nonvolatile memory element and method of manufacturing the same

A method of manufacturing a semiconductor device according to the present invention includes: forming a lower electrode above a substrate; forming, above the lower electrode, a first variable resistance layer comprising a first metal oxide; forming a step region in the first variable resistance layer by collision of ions excited by plasma; removing residue of the first variable resistance layer created in the forming of the step region; forming a second variable resistance layer which covers the step region of the first variable resistance layer, comprises a second metal oxide having a degree of oxygen deficiency lower than a degree of oxygen deficiency of the first metal oxide, and has a bend on a step formed along an edge of the step region; and forming an upper electrode above the second variable resistance layer.

Method of manufacturing semiconductor memory device

A non-volatile memory device includes: a memory cell array including a plurality of memory cells each including a variable resistance element and a first current steering element; and a current steering element parameter generation circuit. The current steering element parameter generation circuit includes: a third line placed between a substrate and a second interlayer dielectric; a fourth line placed above the second interlayer dielectric; and a second current steering element which is connected between the third line and the fourth line without the variable resistance element being interposed therebetween when the variable resistance element is removed between the third line and the fourth line and has the same non-linear current steering characteristics as the first current steering element.

Non-volatile memory device and method for manufacturing the same

A nonvolatile memory device includes a plurality of nonvolatile memory elements each having an upper electrode, a variable resistance layer, and a lower electrode; a first insulating layer embedding the plurality of nonvolatile memory elements, and ranging from a lowermost part of the lower electrode to a position higher than an uppermost part of the upper electrode in each of the nonvolatile memory elements; a second insulating layer being formed on the first insulating layer, and having an average size of vacancies larger than an average size of vacancies included in the first insulating layer, or having an average carbon concentration higher than an average carbon concentration of the first insulating layer; and a conductive layer penetrating the second insulating layer and a part of the first insulating layer and being connected to at least one of the upper electrodes included in the nonvolatile memory elements.

Nonvolatile memory device and method of manufacturing the same

A nonvolatile memory element which inhibits deterioration of an oxygen concentration profile of a variable resistance layer due to a thermal budget and is able to stably operate at low voltages, and a method for manufacturing the nonvolatile memory element are provided. The nonvolatile memory element includes a first electrode layer formed above a substrate, a variable resistance layer disposed on the first electrode layer, and a second electrode layer disposed on the variable resistance layer, and the variable resistance layer has a two-layer structure in which an oxygen- and/or nitrogen-deficient tantalum oxynitride layer and a tantalum oxide layer are stacked.

Variable resistance nonvolatile memory element and method for manufacturing the same

A method of designing a cross-point non-volatile memory device including memory elements arranged in (N&#xd7;M) matrix, each of the memory elements including a variable resistance element and a bidirectional current steering element connected in series with the variable resistance element, the method comprises the step of: when an absolute value of a low-resistance state writing voltage is VR and an absolute value of a current flowing through the variable resistance element having changed to a low-resistance state by application of the low-resistance state writing voltage to both ends of the variable resistance element in a high-resistance state is I, and a relationship between a voltage Vapplied to both ends of the bidirectional current steering element and a current I flowing through the bidirectional current steering element is approximated as |V|=a&#xd7;Log(I)+b, deciding N, M, VR, I, a, and b such that b&#x2212;VR/2&#x3e;a&#xd7;[Log {(N&#x2212;1)&#xd7;(M&#x2212;1)}&#x2212;Log(I)] is satisfied (S).

Designing method of non-volatile memory device, manufacturing method of non-volatile memory device, and non-volatile memory device

A non-volatile memory device includes: a memory cell array including a plurality of memory cells each including a first variable resistance element and a first current steering element and a parameter generation circuit including a reference cell including a second variable resistance element and a second current steering element having the same current density-voltage characteristic as that of the first current steering element, wherein a conductive shorting layer for causing short-circuiting between the electrodes is formed on the side surfaces of the second variable resistance element.

Non-volatile memory device

Provided is a method for manufacturing a variable resistance element, the method including: forming a first electrode material layer above a substrate; forming a first tantalum oxide material layer; forming a second tantalum oxide material layer; forming a second electrode material layer; and annealing at least the first tantalum oxide material layer after forming the first tantalum oxide material layer and before forming the second electrode material layer, wherein an oxygen content percentage of one of the first tantalum oxide material layer and the second tantalum oxide material layer is higher than an oxygen content percentage of the other.

Method for manufacturing variable resistance element

Provided is a method for manufacturing a variable resistance nonvolatile semiconductor memory element, and a nonvolatile semiconductor memory element which make it possible to operate at a low voltage and high speed when initial breakdown is caused, and exhibit favorable diode element characteristics. The method for manufacturing the nonvolatile semiconductor memory element includes, after forming a top electrode of a variable resistance element and at least before forming a top electrode of an MSM diode element, oxidizing to insulate a portion of a variable resistance film in a region around an end face of a variable resistance layer.

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Kyoto, Japan

Yukio Hayakawa