Mitsui Toatsu Chemicals, Incorporated

Mitsui Chemicals, Inc.

Yukio Fukui

Shigeru Iimuro

Shinji Ando

Tatsuhiro Urakami

Teruo Yuasa

Takayoshi Masuda

Sunao Maeda

Tomoyuki Kawabata

Hiroaki Narisawa

Yuzo Ono

Masanobu Maeda

Takaharu Abe

Sinji Ando

Kouji Matui

A modified phenolic resin that is an alternate copolymer of at least one phenolic compound selected from phenol, naphthols, and their derivatives and a compound having a divalent connecting group, said modified phenolic resin having a side chain attached to an aromatic ring having a hydroxy group, said side chain being represented by defined formula (1-1). The modified phenolic resin can be used as a hardener for epoxy resins and a cured product thereof has excellent adhesion and flame retardancy without impairing properties of conventional phenolic resins such as gel time, glass transition temperature, moisture absorption, and mechanical properties. The epoxy resin composition can provide excellent adhesion and flame retardancy as hardeners for semiconductor sealing epoxy resins, insulating materials for electrical/electronic components, and laminates (printed circuit boards). A prepreg containing a glass substrate impregnated with the epoxy resin composition, a laminate, and an electronic circuit board are also provided.

Modified phenolic resin, epoxy resin composition containing the same, and prepreg containing the composition

A preparation process of phenol aralkyl resin from phenol compound and aralkyl compound by controlling the temperature of reaction mass in the range of 70 to 240.degree. C. and simultaneously controlling the temperature of vapor phase potion and vapor-liquid interface portion of manufacturing equipment so as to keep the wall surface of the vapor phase portion and vapor-liquid interface portion in a wet state. The invention can prevent scale adhesion to the interior of manufacturing equipment, remarkably reduce the number of washing and scale removing procedures on the manufacturing equipment, and enable efficient manufacture of phenol aralkyl resin. When the phenol aralkyl resin obtained is used for a molding material, molded articles having excellent heat resistance and high reliability can be provided.

Preparation process of phenol aralkyl resins

A phenolic resin can be obtained by a condensation reaction between a specific trifunctional aromatic compound and a phenolic compound. This resin can be reacted with a curing agent such as a hexamine to give cured articles having excellent heat resistance, electrical properties, wear resistance and chemical resistance, and the phenolic resin is also much more excellent in curing reactivity as compared with conventional techniques.

Phenolic resin and method for preparing same

Photochlorination of aromatic compounds having at least one alkyl side chain is carried out in the presence of an alkylene polyamine previously mixed with an aromatic compound having at least one chlorinated side chain whereby side reactions are suppressed. Aromatic compounds having a monochlorinated side chain are stabilized with an alkylene polyamine. Stainless steel apparatuses can be used in both cases.

Process for preparing aromatic compounds having chlorinated side chains

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Nagoya, Japan

Yukio Fukui