Sony Corporation

Meiji Dairies Corporation

Yukio Asami

Akira Kojima

Hirotaka Kobayashi

Hiroyuki Fukasawa

Tomoshi Ohde

Hideshi Kumai

Akira Murasugi

Isao Kido

Under the regulation of a methanol-inducible alcohol oxidase gene (AOX1) promoter and a transcription termination sequence originating fromyeast, which has been transformed with an expression vector containing an MK family protein gene ligated to an a1 factor signal sequence originating from, is cultured and an intact MK family protein is thus expressed and secreted in a large amount into the culture supernatant.

High level secretory expression system of intact MK family protein

A method for producing an electrode enabling fabrication of small electrodes at a high dimensional accuracy without being affected by the number of connections between chips, comprising the steps of forming an insulating film on an interconnection pattern of a semiconductor chip, forming a mask layer having an opening on the insulating film at a position where an electrode is to be formed, removing the insulating film within the opening by using the mask layer as a mask to expose a portion of the interconnection pattern, forming a conductor layer on the exposed interconnection pattern and the mask layer, removing the conductor layer formed on the mask layer while leaving the conductor layer formed on the exposed interconnection pattern, and removing the mask layer, and a method for producing a semiconductor device provided with such electrode.

Methods for producing electrode and semiconductor device

On the scribe line area formed between a plurality of semiconductor clip areas on a semiconductor wafer, there is provided a chipping prevention portion constituted by a double groove consisting of the first and second grooves. Thus, the entry of chipping into the semiconductor chip area is prevented when dicing the semiconductor wafer along the scribe line area provided between each of the semiconductor chip areas. In this respect, an insulating film may be formed on the surface of the semiconductor wafer on the side of an element forming area.

Semiconductor method of manufacture

On the scribe line area formed between a plurality of semiconductor chip areas on a semiconductor wafer, there is provided a chipping preventing portion constituted by a double groove consisting of the first and second grooves. Thus, the entry of chipping into the semiconductor chip area is prevented when dicing the semiconductor wafer along the scribe line area provided between each of the semiconductor chip areas. In this respect, an insulating film may be formed on the surface of the semiconductor wafer on the side of an element forming area.

Semiconductor device

A semiconductor device is fabricated by placing a semiconductor chip in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers. Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mold surrounding the chip. Furthermore, the mold has horizontal movement restricting projections to limit vertical movement of the chip within the mold cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.

Growing community of inventors

Kanagawa, Japan

Yukio Asami