Nitto-Denko Corporation

Nitto Denko Cororation

Yukio Arimitsu

Akihisa Murata

Kazuyuki Kiuchi

Toshiyuki Oshima

Daisuke Shimokawa

Masaaki Sato

Yoshio Terada

Yasuhiro Amano

Daisuke Uenda

Takamasa Hirayama

Tomoko Kishimoto

Masaaki Mori

Takashi Yamaoka

Yuri Horie

Shinji Hoshino

Tomoko Doi

Kazuki Soejima

The air filter medium of the present invention is an air filter medium including a stack of a porous polytetrafluoroethylene (PTFE) membrane and an air-permeable support member, a repulsive force generated in the medium when the medium is compressed in a thickness direction thereof is equal to or greater than 30 kPa and equal to or less than 150 kPa at a compression ratio of 30%, and at least one main surface of the air filter medium is formed by the air-permeable support member and has a maximum coefficient of friction of 24 gf or less. The air filter medium of the present invention is an air filter medium that uses a porous PTFE membrane and in which a decrease in collection efficiency due to pleating is inhibited.

Air filter medium, filter pleat pack, and air filter unit

The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate, and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a tensile pressure-sensitive adhesive strength of 2.0 to 20 N/20 mm in width and an amount of displacement of 0.3 mm/20 mm in width or less, and the pressure-sensitive adhesive layer for temporary fixing is crosslinked with an isocyanate or epoxy crosslinking agent.

Double-sided adhesive tape or sheet, and adherend processing method

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus

The invention relates to a heat-peelable pressure-sensitive adhesive sheet for cutting a laminated ceramic sheet, which is used for temporary fixing at cutting of the laminated ceramic sheet, the heat-peelable pressure-sensitive adhesive sheet including a base material and, formed on at least one surface of the base material, a heat-expandable pressure-sensitive adhesive layer containing a pressure-sensitive adhesive and a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a gel fraction of 50% by weight or more, and the heat-expandable pressure-sensitive adhesive layer has a glass transition temperature of &#x2212;40&#xb0; C. to 30&#xb0; C.

Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mmis 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

The present invention is intended to solve the following problems with a method for fabricating a substrateless semiconductor package using an adhesive sheet as a temporary fixing supporter. A chip can be displaced from a specified position by pressure during resin encapsulation because the chip is not properly held by the adhesive sheet. If such displacement occurs, the relative positional relationship between the chip and an interconnect to be connected to a specified position in a subsequent wiring step also changes by the displacement of the chip from the specified position. Another problem is that if adhesive deposits occur during peeling of the adhesive sheet and the surface of a package is contaminated with the adhesive deposits, adhesive components left on the surface of the chip can inhibit connection between the interconnect and the chip in a subsequent wiring step. To solve these problems, the present invention provides an adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer has a specific adhesion strength and peel strength.

Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet

The process for producing an organic EL panel according to the present invention is a process for producing an organic electroluminescent panel by forming an organic electroluminescent element on an ultrathin glass plate by vacuum deposition method, including forming electrodes on the ultrathin glass plate, by temporarily fixing the ultrathin glass plate to a supporting plate via a double-sided adhesive tape having a thermal release adhesive layer formed at least on one face of the base material layer, containing heat-expandable microspheres that start expansion and/or foaming at temperature higher than the vacuum deposition temperature.

Process for producing organic electroluminescent panel

Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer due to pressurization in a pressing process and can be easily peeled off from the processed article. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate and containing a foaming agent, in which the heat-expandable pressure-sensitive adhesive layer has a shear modulus (23&#xb0; C.) in an unfoamed state of 7&#xd7;10Pa or more. The heat-expandable pressure-sensitive adhesive layer preferably has a shear modulus (95&#xb0; C.) in an unfoamed state of less than 7&#xd7;10Pa. The foaming agent in the heat-expandable pressure-sensitive adhesive layer preferably has a foam initiating temperature higher than 80&#xb0; C.

Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet

A heat-peelable pressure-sensitive adhesive sheet comprises: a base material; and a thermo-expandable pressure-sensitive adhesive layer containing thermo-expandable microspheres, the thermo-expandable pressure-sensitive adhesive layer having a surface to be adhered to an adherend, wherein the surface of the thermo-expandable pressure-sensitive adhesive layer before subjecting to heating has a centerline average roughness of greater than 0.4 &#x3bc;m, and has a convex portion resulting from the thermo-expandable microspheres.

Heat-peelable pressure-sensitive adhesive sheet

Disclosed is a thermal-release double-coated pressure-sensitive adhesive tape or sheet which includes a substrate, a foaming agent-free pressure-sensitive adhesive layer (A) arranged on one side of the substrate, and a foaming agent-containing pressure-sensitive adhesive layer (B) arranged on the other side. The pressure-sensitive adhesive layer (A) contains 5 to 30 parts by weight of a plasticizer and 100 parts by weight of a base polymer and has a tensile adhesive strength of 1 N/20 mm in width or less with respect to a poly(ethylene terephthalate) film as determined at a peel angle of 180 degrees, a rate of pulling of 300 mm/minute, a temperature of 23&#xb1;2&#xb0; C., and a relative humidity of 65&#xb1;5%. The weight loss of plasticizer is 2 percent by weight or less when the tape or sheet is heated at a temperature of 165&#xb0; C. and a pressure of one atmosphere for one hour.

Thermal-release double-coated pressure-sensitive adhesive tape or sheet and method of processing adherend

A method of thermal adherend release, wherein a part of adherends adherent to a heat-peelable pressure-sensitive adhesive sheet having a heat-expandable layer containing a foaming agent are selectively released from the pressure-sensitive adhesive sheet by partly heating the heat-peelable pressure-sensitive adhesive sheet, wherein the method comprises previously heating a sticking site of an adherend to be released at a temperature at which the heat-expandable layer of the heat-peelable pressure-sensitive adhesive sheet does not expand and then heating the sticking site of the adherend in the heat-peelable pressure-sensitive adhesive sheet at a temperature at which the heat-expandable layer expands to thereby selectively releasing the adherend.

Method of thermal adherend release and apparatus for thermal adherend release

Disclosed is a heat-peelable pressure-sensitive adhesive sheet that can prevent the deformation of a pressure-sensitive adhesive layer caused by pressurization, further reduce chipping in grinding and cutting processes, be easily peeled off from a processed article after processing, and can be easily applied to an adhered at ordinary temperature. The heat-peelable pressure-sensitive adhesive sheet includes a substrate, and a heat-expandable pressure-sensitive adhesive layer arranged on or above at least one side of the substrate, the heat-expandable pressure-sensitive adhesive layer containing a foaming agent and having a shear modulus (23&#xb0; C.) in an unfoamed state of 7&#xd7;10Pa or more. The adhesive sheet further includes a pressure-sensitive adhesive layer being arranged on or above heat-expandable pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer has a shear modulus (23&#xb0; C.) of less than 7&#xd7;10Pa and a thickness of 0.01 to 10 &#x3bc;m.

A heat-peelable adhesive sheet which shows small increase in the degree of contamination caused by a heat treatment for lowering an adhesive force is disclosed. The heat-peelable pressure sensitive adhesive sheet comprises a heat-expandable layer containing heat-expandable microspheres and expanding upon heating, and a non-heat expandable pressure-sensitive adhesive layer formed on at least one side thereof. The heat-peelable pressure-sensitive adhesive sheet can achieve the desired adhesive properties such as an excellent adhesive force before heating and also show a quick lowering of the adhesive force upon heating. Further, it shows small increase in the degree of contamination due to the treatment for lowering the adhesive force. Due to those characteristics, the heat-peelable pressure-sensitive adhesive sheet is practically applicable to, for example, the production of electronic parts made of thinner semiconductor wafers.

A heat-peelable adhesive sheet which comprises a substrate and, formed on at least one side thereof, a heat-expandable layer containing heat-expandable microspheres and an adhesive layer comprising an adhesive substance and in which the substrate has heat resistance and stretchability can be used to cut an adherend so as to form and secure a sufficient space between the resultant cut pieces and can withstand a heat treatment for expanding the heat-expandable layer. Consequently, the adhesive sheet can heighten the operating efficiency and working efficiency in the step of separating and recovering the cut pieces.

Heat-peelable adhesive sheet

A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 &#x3bc;m or less.

Growing community of inventors

Osaka, Japan

Yukio Arimitsu