Fuji Corporation

Fuji Machine Mfg. Co., Ltd.

Yukinori Nakayama

Satoshi Yoshioka

Kenji Nakai

Shinichi Fujii

Hideyasu Takamiya

Mitsuaki Oiki

Satoshi Sugiura

An information processing device of the present disclosure is used in a mounting system including multiple mounting-related devices each having a display section that visually notifies an operator of information and an attachment portion to which a member is attached and related to a process of mounting a component on a processing target object, and a moving work device that is moved between the multiple mounting-related devices to automatically attach and detach the member to and from the attachment portion. The information processing device includes a control section that outputs, to the display section, notification information including work details that are substitutable by the operator in association with a status of the moving work device based on a predetermined priority order based on continuation of processes of the mounting-related devices.

Information processing device and information processing method

A component mounter for mounting electronic components includes a mounting head with at least two suction nozzles in the multiple suction nozzles are lowered simultaneously so as to pick up at least two electronic components simultaneously. A control device, which is configured to control electronic component pickup and mounting operations, causes the mounting head to move so as to position the at least two suction nozzles that are lowered simultaneously in an electronic component pickup operation step to be located individually on at least two trays on the pallet, causes the at least two suction nozzles to be lowered simultaneously, and causes electronic components on the at least two trays to be picked up simultaneously.

Component mounter

A component mounting machine includes a control device that controls a wafer supply device and a component transfer device. The control device includes a die information storage section storing the position of the dies stored in the wafer supply device associated with a rank of the dies, a block information acquisition section acquiring the condition of the dies to be mounted on a block provided on a board, a rank designation section designating the rank of the die to be picked up by the component transfer device, and a position designation section designating the position of the die to be picked up by the component transfer device. The position designation section designates the position of the die so that the die having the rank designated by the rank designation section is continuously picked up over the multiple wafers stored in the wafer supply device.

Component mounting machine

A wafer supply device configured to supply a wafer divided into multiple dies to a supply position, the wafer supply device includes a die information storage section configured to store the number of dies for each rank allocated to each of the dies, a block information acquisition section configured to acquire a condition of dies to be mounted on a block provided on a board to be conveyed, a required block number acquisition section configured to acquire a required number of dies to be mounted on the block, and a producible number calculation section configured to calculate a number of blocks that can be produced based on a content stored in the die information storage section and a content acquired by the block information acquisition section and the required block number acquisition section.

Wafer supply device

A die mounting system in which die supply device is set on component mounter and dies supplied from die supply device are mounted on circuit board by mounting head of component mounter, determines the next die transfer position is determined such that the longer of time required for die transfer preparation operation (die imaging and image processing, die pickup operation, and movement and vertical inverting operation of a supply head) of die supply device and time required for die mounting operation (movement and vertical motion at the mounting position of mounting head) of component mounter is made shorter, and the difference (which corresponds to the waiting time at the die transfer position) between the two times decreased, such that the cycle time is shortened.

Die mounting system and die mounting method

A supply head of a die supply apparatus is detachably held by a head holding unit of a head moving mechanism. The supply head held by the head holding unit is replaceable with a supply head having the same number of nozzles as the number of nozzles of a mounting head of a component mounting machine. A nozzle arrangement of the supply head of the die supply apparatus has the same arrangement as a nozzle arrangement of the mounting head of the component mounting machine.

Die supply apparatus

A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism. An order of an operation for inverting the wafer component and mounting the wafer component on the circuit substrate and an operation for mounting the feeder component on the circuit substrate is set so that the supply head and the mounting head do not interfere with each other; and an operation for moving down the supply head and the stage, allowing the wafer component to be sucked by the supply head, and inverting the wafer component is performed so as to overlap with an operation for sucking and mounting the feeder component by the mounting head.

Control system and control method for component mounting machine

In a die mounting system in which a die supply device is set on a component mounter and dies supplied from a die supply device are mounted on a circuit board by a mounting head of the component mounter, the position of a die is recognized by processing an image of the die on a dicing sheet captured by a camera, a supply head is moved to a die pickup position by a supply head moving mechanism, the die is picked up, the supply head is vertically inverted and moved to a die transfer position, and the die held by the supply head is picked up by a mounting head of the component mounter at a component transfer position and mounted on the circuit board. The die transfer position is set at a position such that die transfer and die imaging are able to be performed in parallel.

Growing community of inventors

Hekinan, Japan

Yukinori Nakayama