Denso Corporation

Yukinori Migitaka

Takanori Teshima

Yoshimi Nakase

Teruhiko Iwase

Takashi Aoki

Masashi Totokawa

Kazuo Kato

Hirokazu Imai

Yasunori Ninomiya

Motoki Takahira

An indicator panel is shaped by thermoforming an indicator panel. The indicator panel includes a resin substrate and an inkjet design film on the substrate. The design film is formed by printing a UV hardening ink in an inkjet printing, and hardening. A crack and a removal of the design film can be decreased such that the formed indicator panel can have a high-quality design.

Indicator panel and method of manufacturing the same

An indicator panel for an instrument includes a translucent resin substrate having a first face and a second face opposite to the first face, and a design film on the first face of the substrate. The design film includes a translucent portion through which a light from the second surface of the substrate is transmitted, and an opaque portion which does not transmit the light from the second face of the substrate. The design film is produced by jetting droplets of a UV hardening type colored ink to the first face of the substrate in an inkjet printing, and radiating ultraviolet rays for a time within one second from the jetting so as to harden a mass of the droplets, in which a volume of the droplets is equal to or less than 30 pl.

Indicator panel for instrument and method of manufacturing the same

A conductive adhesive is formed by mixing a plurality of conductive fillers into a thermosetting resin. The conductive filler includes a core material made of copper-based metal, a coating film made of silver and a plurality of particles made of silver. The coating film is provided on the core material to cover the core material, and the particles are provided on a surface of the coating film. Accordingly, a surface of the core material is prevented from being exposed. The conductive adhesive can be suitably used for bonding two members.

Conductive adhesive, method of producing the same, and bonding method

A semiconductor element, and a pair of insulation substrates sandwiching the semiconductor element therebetween forms a substrate unit. The substrate unit is press-fitted in a recess provided between first radiation block and cooling block. The press-fitting of the substrate unit is performed by a second radiation block which is screwed to push the first radiation block toward the cooling block. A high thermal-conductive radiation material is disposed at the interfaces between each of the insulation substrates and each of the blocks to keep adhesiveness therebetween.

Growing community of inventors

Kasugai, Japan

Yukinori Migitaka