Tokyo Electron Limited

Tokyo Electron Limi Ted

Yukinori Hanada

Kazushi Kaneko

Genki Koguchi

Akio Morisaki

A device monitors a pulse frequency and a duty ratio of a microwave generated by a microwave output device provided in a plasma processing apparatus. The plasma processing apparatus includes a chamber main body, the microwave output device, a wave guide tube, and a tuner. The microwave output device generates the microwave of which power is pulse-modulated. The device includes a wave detection unit and an acquisition unit. The wave detection unit detects a measured value corresponding to travelling wave power of a microwave in the wave guide tube. The acquisition unit acquires a frequency and a duty ratio of the travelling wave power on the basis of the measured value detected by the wave detection unit.

Pulse monitor device and plasma processing apparatus

A microwave output device include: a microwave generation unit configured to generate a microwave, power of the microwave being pulse-modulated such that a pulse frequency, a duty ratio, a high level, and a low level respectively corresponding to a setting pulse frequency, a setting duty ratio, high level setting power, and low level setting power given from a controller; and an output unit configured to output a microwave propagating from the microwave generation unit, wherein the microwave generation unit alternately generates a microwave having a center frequency and a bandwidth respectively corresponding to a setting frequency and a setting bandwidth given from the controller and a microwave having a single frequency peak at a center frequency corresponding to a setting frequency given from the controller, in synchronization with switching between a high level and a low level of the power.

Microwave output device and plasma processing apparatus

There is provided a plasma processing method capable of carrying out a stable plasma process by way of improving plasma stabilization and also capable of increasing lifetime of a variable capacitor in a matching unit, as compared to a conventional case. The plasma processing method comprises performing a power modulation that periodically switches the high frequency power from the high frequency power supply between a first power and a second power higher than the first power, and performing a mask control that stops a matching operation of the matching unit for an application time of the first power and for a preset time after an application of the second power is started.

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Miyagi, Japan

Yukinori Hanada