Nagano Keiki Co., Ltd.

Other

Yokogawa Electric Corporation

Yukimitsu Sekimori

Seiichi Yokoyama

Fumio Kaise

Hiroji Ito

Daiji Uehara

Naohiko Maruno

A diaphragm seal includes a first diaphragm that faces a measurement medium, a sealed-liquid housing, and a second diaphragm. The first diaphragm receives pressure from the measurement medium. The sealed-liquid housing houses a sealed liquid for transferring the pressure to a transmitter. The second diaphragm causes hydrogen intruded into the sealed liquid to permeate through the second diaphragm and be discharged from the sealed liquid.

Diaphragm seal and maintenance method thereof

A pressure sensorincluded an upper substratehaving a detection faceA, a diaphragmprovided with a space from the detection substrateand displaceable to and from the upper substrate, fixed electrodesprovided on the detection faceA of the upper substrate, and a first signal fetching sectionelectrically connected to the diaphragm, and the diaphragmis formed by dry-etching single-crystal silicon with the specific resistance lowered to 1.0 &#x3a9;&#xb7;cm or below by mixing dopant lowering the resistance value.

Converter and method of manufacturing the same

In a pressure sensor chip (,), an extension (,) is provided on a lower glass (,) and a signal receiving portion (,) of a conductive layer is formed from a surface (,A) of an extension (,) to an upper surface (,B) of an upper glass (,). Accordingly, the signal receiving portion (,) does not touch a circuit substrate when the pressure sensor chip (,) is mounted to the circuit substrate and the like, thereby preventing electric failure such as noise pickup of the signal receiving portion (,). Further, since the signal receiving portion (,) is formed by the conductive layer, no particular space for receiving electric potential from a diaphragm is necessary, thereby enabling size reduction of the pressure sensor chip (,). Since an anodic-bonding electrode (,) is disposed on a border (,) and is cut and removed in separating as the pressure sensor chip (,), visual check is not obstructed and contamination by being peeled-off can be prevented.

Sensor chip, laminated wafer for sensor chip and manufacturing method of sensor chip

In an electrostatic capacitance type transducer which has a substrate, a movable electrode confrontingly placed to the substrate in a movable manner through a space, a fixed electrode arranged on a detecting face confronting the movable electrode of the substrate, and a signal receiving portion which is conductive with the fixed electrode and derived from the detecting face of the substrate, the fixed electrode and the signal receiving portion are made of metals which are different with each other in their compositions. That is, the fixed electrode is made of metal which has a high corrosion resistance and is not likely to outbreak a hillock, and the signal receiving portion is made of metal which is easy for bonding. Alternatively, both the fixed electrode and the signal receiving portion are made of titanium. Through this, since the outbreak of the hillock can be prevented, the displacement of the movable electrode can be stably and precisely detected for a long time, and the shortening of the life of the fixed electrode caused by corrosion can be prevented. As to the signal receiving portion, an excellent bonding property can be ensured.

Electrostatic capacitance type transducer

The present invention provides an electrostatic capacitance type transducer and a method for producing the same, with the ensured sufficient connecting strength and insulation between a movable electrode and a fixed electrode and smooth production. In the electrostatic capacitance type transducer having: a substrate; a movable electrode placed on the opposite side of a space from the substrate and having displacement in relation to the substrate; and a fixed electrode formed on a detecting face of the substrate which is opposite to the movable electrode, an insulation film is formed on the approximately whole surface, including the fixed electrode, of the detecting face of the substrate, in which the substrate and the movable electrode are connected through the insulation film to each other by means of the anode-contact.

Growing community of inventors

Tokyo, Japan

Yukimitsu Sekimori