Hitachi Chemical Company, Ltd.

Yukiko Muramatsu

Masahiro Miyasaka

Shota Okade

Ken Sawabe

Emiko Oota

Sanchoru Ri

Hanako Nankawa

A photosensitive resin composition includes (A) a binder polymer having a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a structural unit derived from a (meth)acrylic acid; (B) a photopolymerizable compound having an ethylenically unsaturated bond group; (C) a photopolymerization initiator; and (D) a styryl pyridine represented by the Formula (1). In Formula (1), each of R, Rand Rindependently represents an alkyl group having from 1 to 20 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, an alkyl ester group having from 1 to 6 carbon atoms, an amino group, an alkyl amino group having from 1 to 20 carbon atoms, a carboxy group, a ciano group, a nitro group, an acetyl group or a (meth)acryloyl group, each of a, b and c independently represents an integer of from 0 to 5. In a case in which each of a, b and c is independently 2 or more, the plural Rs, Rs, and Rs independently may be the same or different. 

Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board

A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or &#x3b1;-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.

Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. [In formulas (I), (II) and (III), R, R, Reach independently represents a hydrogen atom or a methyl group, Ris C1-C3 alkyl group, etc., m is an integer of 0-5, R, Rand Reach independently represents a hydrogen atom or a C1-C5 alkyl group, and at least two among R, Rand Rare C1-C5 alkyl groups.]

Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board

The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator.

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Tokyo, Japan

Yukiko Muramatsu