Toppan Inc.

Yukiko Katano

Tetsuya Tsukada

Shigeki Minemura

Shin Kataoka

Eriko Uehara

Misaki Nonaka

A card-type medium includes a card body; an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface; and a circuit board that is embedded in the card body and to which the exposed component is attached. The exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween. The first exposed component and the intermediate spacer are joined together by a first conductive joining material. The circuit board and the intermediate spacer are joined together by a second conductive joining material. A joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material are different from each other.

Card-type medium and card-type medium manufacturing method

An IC card provided with an IC chip, and configured to enable at least one of contact communication and contactless communication, the IC card including an ultrasonic fingerprint sensor connected to the IC chip and a storage unit in which fingerprint data for matching is stored. An outer surface of the IC card is formed of synthetic resin, and the ultrasonic fingerprint sensor is covered with the synthetic resin.

IC card and method for manufacturing IC card

A card medium includes: a card body containing a metal material and having at least one aperture at a front surface thereof; an electronic component disposed in the at least one aperture and having an outer peripheral surface facing an aperture inner peripheral surface of the at least one aperture with a clearance from the aperture inner peripheral surface, at least part of the outer peripheral surface including a conductor exposed portion at which a conductor having conductive properties is exposed; a circuit substrate which is embedded into the card body and to which the electronic component is joined; and an electrical insulation portion provided between the electronic component and the aperture inner peripheral surface.

Card medium, electronic component for card medium, and metal card substrate for card medium

A card-type medium includes: a card body; an internal component embedded in the card body; an exposed component partially exposed on a front surface of the card body; and a circuit board to which the internal component and the exposed component are bonded, wherein the circuit board includes a first connection portion to which the internal component is bonded, a second connection portion to which the exposed component is bonded, the second connection portion being located at a position different from the first connection portion in a card thickness direction connecting the front surface of the card body and a rear surface on an opposite side of the card body to the front surface, and a connection wiring portion that connects the first connection portion and the second connection portion, the connection wiring portion extending in a direction including the card thickness direction.

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Tokyo, Japan

Yukiko Katano