Hitachi, Ltd.

Yukiko Iwama

Yasushi Neho

Naoyuki Sakamoto

Hitoshi Matsushima

Tadakatsu Nakajima

Shigeo Ohashi

Yoshihiro Kondo

Tsuyoshi Nakagawa

Susumu Iwai

Yoshito Ohmura

Atsuhiko Urushihara

Taisuke Kashima

Tadahiro Yamaguchi

Noriyoshi Ogura

Masahide Aoki

Yasuhiro Kasahara

Tadashi Sube

Tooru Kiyota

A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.

Heat dissipation structure for a personal computer including two heat

A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard.

Heat dissipation structure for electronic equipment including two heat

The present invention makes a variety of improvements on the conventional television receiver to enhance the home communication capability thereof, thereby making the television receiver available as an information terminal apparatus for household use. The novel television receiver that receives a television signal to display a television image on screen comprising: a memory; a microphone through which voice information is entered externally; writing section for writing at least one piece of the voice information entered through the microphone and additional information associated with the at least one piece of voice information into the memory; and a display device for reproducing the at least one piece of voice information stored in the memory and outputting the reproduced voice information through a speaker and displaying the additional information associated with the at least one piece of voice information onto the screen. The memory stores as a message the voice information entered through the microphone. The stored message is reproduced according to an externally given instruction and the reproduction is outputted to a speaker to transmit the message to other persons with ease.

Television receiver having multiple communication capabilities

A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.

Heat dissipation structure in a portable computer including a heat

Portable computer

Growing community of inventors

Kokubunji, Japan

Yukiko Iwama