Sumitomo Chemical Company, Limited

Hayashibara Biochemical Laboratories, Inc.

Yukikazu Uemura

Takezo Sano

Akihiro Furuta

Tadanori Inoue

Yasunori Uetani

Haruyoshi Osaki

Teruo Saito

Makoto Hanabata

Haruo Hayashida

Nobuo Fukushima

Takuzo Okumura

Fumio Oi

Hiroomi Matsunaga

Hiroshi Ishida

Takao Ninomiya

A novolak resin for a positive photoresist is provided herein, which resin is produced by the addition condensation reaction of a phenol with formaldehyde. This novolak resin has improved heat resistant and sensitivity properties and the thickness retention of the novolak resins are very high. The novolak resins are characterized in that the area ratio of the gel permeation chromatographic pattern (GPC) as measured by the use of a UV(254 nm) detector, is as follows: a range wherein the molecular weight, calculated as polystyrene, is from 150 to less than 500, not including a phenol and the unreacted monomer, is from 8 to 35%, hereinafter referred to as an A region, the range wherein the molecular weight calculated as polystyrene is from 500 to less than 5000 is from 0 to 30%, hereinafter referred to as a B region, and the range wherein the molecular weight calculated as polystyrene exceeds 5000 is from 35 to 92%, hereinafter referred to as the C region, and wherein the ratio of the B region to the A region is 2.50 or less.

Novolak resin for positive photoresist

Relieved pattern of a resin original pattern plate, which does not exhibit fluidity at transferring temperature and possesses elastic modulus no smaller than 10 kg/cm.sup.2, preferably no smaller than 100 kg/cm.sup.2, is transferred onto thermoplastic resin material having fluidity at the transferring temperature (ASTM D1238, load 21.6 kg) of at least 0.01 dg/min, preferably at least 0.1 dg/min, by pressing the thermoplastic resin material to the original pattern plate under a pressure condition where elastic deformation of the original pattern plate is kept within 10%. The resin original pattern plate is prepared by controlling the photo-polymerizable resin composition to adjust its crosslink-ability and then photo-polymerizing, whereby the resulting resin original pattern plate possesses an elastic modulus of 10 kg/cm.sup.2 or higher at transferring temperature. The photo-polymerizable resin composition includes, as its major ingredients, either polymer, polyfunctional monomer (10-90% by weight, preferably 30-70% by weight, and having viscosity of at least 10.sup.3 poise at transferring temperature), photo-sensitizer and thermal polymerization inhibitor, or cross-linkable polymer (having at least 1000 molecular weight and double bonds at least one for each 1000 molecular weight), monomer (5-50% by weight, preferably 10-40% by weight), photosensitizer and thermal polymerization inhibitor.

Resin original pattern plate and method for transferring relieved

An original pattern plate obtained by the use of a photo-sensitive resin composition comprising:

Original pattern plate obtained by use of photo-sensitive resin

A polyester resin composition having excellent mechanical properties, processability, transparency and surface glossiness of the formed product thereof, which comprises 1 to 99% by weight of an aromatic polyester produced by polycondensing para-hydroxybenzoic acid or a functional derivative thereof (I), 2,2-bis(4'-hydroxyphenyl)propane or a functional derivative thereof (II), and terephthalic acid or a functional derivative thereof (III) and/or isophthalic acid or a functional derivative thereof (IV) in a molar ratio of (I):(II)=1:100 to 100:1 and (II):(III) and/or (IV)=1:10 to 10:1 and 99 to 1% by weight of a polycarbonate or an aliphatic polyester.

Polyester resin composition

Relieved pattern of a resin original pattern plate, which does not exhibit fluidity at transferring temperature and possesses elastic modulus no smaller than 10 kg/cm.sup.2, preferably no smaller than 100 kg/cm.sup.2, is transferred onto thermoplastic resin material having fluidity at the transferring temperature (ASTM D1238, load 21.6 kg) of at least 0.01 dg/min, preferably at least 0.1 dg/min, by pressing the thermoplastic resin material to the original pattern plate under a pressure condition where elastic deformation of the original pattern plate is kept within 10%. The resin original pattern plate is prepared by controlling the photopolymerizable resin composition to adjust its cross-linkability and then photo-polymerizing, whereby the resulting resin original pattern plate possesses an elastic modulus of 10 kg/cm.sup.2 or higher at transferring temperature. The photo-polymerizable resin composition includes, as its major ingredients, either polymer, polyfunctional monomer (10- 90% by weight, preferably 30- 70% by weight, and having viscosity of at least 10.sup.3 poise at transferring temperature), photo-sensitizer and thermal polymerization inhibitor, or cross-linkable polymer (having at least 1000 molecular weight and double bonds at least one for each 1000 molecular weight), monomer (5- 50% by weight, preferably 10- 40% by weight), photosensitizer and thermal polymerization inhibitor.

Crosslinkable composition

A method for producing a high-strength film of amorphous aromatic high polymers comprising rolling said polymer between rolls, and stretching the rolled film of said polymer.

Method of manufacturing oriented amorphous aromatic polymeric films

A photosensitive resin composition comprising pullulan, which is a polymer having repetition units of maltotriose and is represented by the formula, ##SPC1## Wherein n is an integer of 20 to 8,000, and/or a derivative thereof, a photopolymerizable monomer, a photosensitizer and a thermal polymerization inhibitor, or comprising the said pullulan, which has been incorporated with a photoactive reaction group to provide photosensitivity, and a photosensitizer, is a novel composition low in viscosity which can be prepared by use of water and can be formed into a photosensitive plate capable of being developed with water to give a clear image. Since the pullulan in said composition has no toxicity, the waste water formed at the time of development of said photosensitive plate can be treated with ease.

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Amagasaki, Japan

Yukikazu Uemura