Sony Corporation

Sony Semiconductor Solutions Corporation

Sumitomo Chemical Company, Limited

Sony Semiconductor Solutions Cororation

Yukihiro Sayama

Sintaro Nakajiki

Yuka Nakamoto

Masaya Shimoji

Takayuki Shoya

Yuichi Seki

Nobuyuki Ohba

Yoshinori Toumiya

Akiko Ogino

Yoshikazu Tanaka

Tadayuki Dofuku

Toshinori Inoue

Atsushi Yamamoto

Taichi Natori

Hitomi Kamiya

Ina Hori

Yasunori Koshino

Youichi Otsuka

Kazuaki Ogawa

Masanori Harasawa

Yoshinori Uchida

Hiroki Endo

Kazuhiro Machiguchi

Yuuji Ueda

Toyomi Jinwaki

Syunji Horiuchi

Ami Higashitani

Hiroaki Mizoguti

Youichi Hirotani

The present technology relates to a solid-state imaging device, a manufacturing method, and an electronic device, which can improve sensitivity while improving color mixing. The solid-state imaging device includes a first wall provided between a pixel and a pixel arranged two-dimensionally to isolate the pixels, in which the first wall includes at least two layers including a light shielding film of a lowermost layer and a low refractive index film of which refractive index is lower than the light shielding film. The present technology can be applied to, for example, a solid-state imaging device, an electronic device having an imaging function, and the like.

Solid-state imaging device, manufacturing method thereof, and electronic device

The present technology relates to a solid-state imaging apparatus capable of suppressing occurrence of color mixing, a method for manufacturing the solid-state imaging apparatus, and an electronic device. The solid-state imaging apparatus includes a plurality of pixels arranged in a pixel region. Each of the pixels has: a first optical filter layer disposed on a photoelectric conversion unit; a second optical filter layer disposed on the first optical filter layer; and a separation wall separating at least a part of the first optical filter layer for each of the pixels. Either the first optical filter layer or the second optical filter layer in at least one of the pixels is formed by an infrared cut filter, while the other is formed by a color filter. The present technology can be applied to a CMOS image sensor including a visible light pixel.

Solid-state imaging apparatus, method for manufacturing the same, and electronic device

An imaging device and electronic apparatus incorporating an imaging device are provided. The imaging device includes a substrate and a plurality of photoelectric conversion units formed in the substrate. Each photoelectric conversion unit in the plurality of photoelectric conversion units is associated with at least one corresponding color filter in the plurality of color filters. The imaging device further includes a plurality of infrared light filters, wherein at least some of the photoelectric conversion units in the plurality of photoelectric conversion units are associated with at least one corresponding infrared light filter in the plurality of infrared light filters.

Imaging element and imaging apparatus

There is provided a solid-state imaging device including: an imaging pixel including a photoelectric conversion unit which receives incident light; and a phase difference detection pixel including the photoelectric conversion unit and a light shielding unit which shields some of the light incident to the photoelectric conversion unit, in which the imaging pixel further includes a high refractive index film which is formed on the upper side of the photoelectric conversion unit, and the phase difference detection pixel further includes a low refractive index film which is formed on the upper side of the photoelectric conversion unit.

Solid-state imaging device, manufacturing method of the same, and electronic apparatus having filters of different thicknesses

The present technology relates to a solid-state imaging element, a manufacturing method of the same, and an electronic device that achieve the extension of a dynamic range by making a difference in light-receiving sensitivity between low-sensitivity pixels and high-sensitivity pixels without changing spectral characteristics. The solid-state imaging element includes a pixel array portion in which two kinds of pixels different in light-receiving sensitivity, high-sensitivity pixels and low-sensitivity pixels are arrayed. The low-sensitivity pixels have a gray filter on or under a color filter to decrease light transmission factor in a visible-light region by a predetermined ratio. The present technology is applicable to solid-state imaging elements and the like, for example.

Solid-state imaging element, manufacturing method of the same, and electronic device

Solid-state imaging device with phase difference detection pixel and manufacturing method of the same, and electronic apparatus

There is provided a solid-state imaging device which includes a plurality of pixels including an imaging pixel for generating a captured image and a focus detection pixel for detecting a focus, in which the focus detection pixel includes a microlens, a photoelectric conversion unit which receives light incident from the microlens, a light-shielding unit which shields a portion of light incident on the photoelectric conversion unit, and a dimming filter which dims the light incident on the photoelectric conversion unit and is formed to contain a black pigment. The present technology can be applied to, for example, a CMOS image sensor.

Solid-state imaging device, manufacturing method thereof, and electronic apparatus

Solid-state imaging device and manufacturing method of the same, and electronic apparatus

Provided is an image pickup element, including: condenser lenses made of a resin containing fine metal particles; photoelectric conversion elements formed in a silicon substrate and each configured to photoelectrically convert incident light that enter from an outside through corresponding one of the condenser lenses; and a protective film made of a silicon compound, the protective film being formed between the condenser lenses and the silicon substrate.

Image pickup element, imaging apparatus, manufacturing apparatus for image pickup element, and manufacturing method for image pickup element

Disclosed herein is a solid-state image pickup device including a solid-state image pickup element operable to produce an electric charge according to the amount of light received, a lens disposed on the upper side of a pixel of the solid-state image pickup element, a protective film which covers the upper side of the lens and a surface of which is flattened, and a surface film which is formed at the surface of the protective film and which is higher in hydrophilicity than the inside of the protective film.

Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus

A solid-state image capture device including: at least one photoelectric converter at an image capture surface of a substrate; at least one on-chip lens at the image capture surface of the substrate and above a light-receiving surface of the photoelectric converter; and an antireflection layer on an upper surface of the on-chip lens. The antireflection layer contains a binder resin having a lower refractive index than that of the on-chip lens and low-refractive-index particles having a lower refractive index than that of the binder resin.

Solid-state image capture device, manufacturing method therefor, and electronic apparatus

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Kumamoto, Japan

Yukihiro Sayama