Kabushiki Kaisha Toshiba

Tokyo Shibaura Denki Kabushiki Kaisha

Yukihiro Mikogami

Yoshihiko Nakano

Shuzi Hayase

Shinji Murai

Masayuki Oba

Naoko Kihara

Rumiko Hayase

Shigeru Matake

Shuji Hayase

Akira Yoshizumi

Shuichi Suzuki

Moriyasu Wada

Naohiko Oyasato

Kei Takano

Satoshi Mikoshiba

Takeo Ito

Yoshiaki Kawamonzen

Tamotsu Shirogami

Mitsushi Ueno

Cao Minh Thai

Rikako Kani

Yuusuke Wada

Kazuhiko Kurematsu

Tsuguo Sakamoto

Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.

(Hetero)aromatic ether, (thio)ester or (thio)carbonate epoxy catalyst

Aromatic curing catalyst for epoxy resins

A polyimide precursor having a molecular structure obtained by polymerizing (a) 0.97 to 1.03 molar equivalent of a diamine component containing 0.40 molar equivalent or more of aromatic diamine compound represented by the general formula (DA1), and (b) an acid anhydride component containing (1-n.sub.1 /2) molar equivalent of a tetracarboxylic dianhydride and n.sub.1 molar equivalent of at least one selected from the group consisting of maleic anhydride and maleic derivative anhydride, wherein n.sub.1 ranges from 0.02 to 0.40. ##STR1##

Polyimide precursor, bismaleimide-based cured resin precursor and

Disclosed is a photosensitive resin composition, containing a polyamic acid derivative having a repeating unit represented by general formula (1) given below and a photosensitive agent: ##STR1## where, R.sup.1 represents a tetravalent organic group, R.sup.2 represents a divalent organic group, and R.sup.3 and R.sup.4 represent a monovalent organic group, at least one of R.sup.3 and R.sup.4 being an organic group having at least on hydroxyl group bonded to an aromatic ring. A semiconductor substrate is coated with the photosensitive resin composition, followed by exposing the coated film to light through a patterning mask and subsequently applying a development and a heat treatment so as to form a polyimide film pattern. A baking treatment also be applied immediately after the exposure step. The photosensitive resin composition of the present invention performs the function of a positive or negative photoresist film and the function of a polyimide protective film on a semiconductor substrate.

Method of forming polyimide film pattern

A photosensitive composition comprises a polysilane having a repeating unit represented by formula (1) and a compound which generates an acid upon exposure to light: ##STR1## wherein each of R.sup.1 and R.sup.2 independently represents a hydrogen atom, a substituted or nonsubstituted alkyl group having 1 to 18 carbon atoms, a substituted or nonsubstituted aryl group having 6 to 18 carbon atoms, or a substituted or nonsubstituted aralkyl group having 7 to 22 carbon atoms. This photosensitive composition exhibits a high-sensitivity, and can be formed into a polysilane film pattern having a high-resolution, when it is subjected to exposure to Deep UV light, an EB, an X-ray, or the like, hard baking, and development under appropriate conditions. When an aromatic ring substituted by a hydroxyl group, a substituted or nonsubstituted alkoxyl group, or a substituted or nonsubstituted siloxyl group is introduced in one of side chains R.sup.1 and R.sup.2 of the polysilane, development using an alkaline solution can be employed.

Photosensitive composition comprising a polysilane and an acid forming

Disclosed are a polysilane monomolecular film and a polysilane built-up film formed by building up a plurality of said monomolecular films, said monomolecular film consisting of a polysilane having a repeating unit represented by general formula (1) given below: ##STR1## where, R.sup.1 represents a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms or a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, R.sup.2 represents a divalent hydrocarbon group having 1 to 4 carbon atoms which can be substituted, and X represents hydroxyl group, amino group, carboxyl group, or a hydrophilic group having at least one selected from the group consisting of hydroxyl group, amino group, carboxyl group, amide linkage, ester linkage, carbamate linkage and carbonate linkage. The polysilane monomolecular film and built-up film can be formed on a substrate by an LB technique. In the films, the molecules of the polysilane having the repeating unit (1), that is, the Si-Si backbones are oriented in a fixed direction.

Polysilane monomolecular film and polysilane built-up film

Photosensitive resin composition for forming polyimide film pattern

A photosensitive composition contains a polyimide constituted by a repeating unit having a hydroxyl group and a repeating unit having a siloxane bond, or a repeating unit having a hydroxyl group, a repeating unit having a siloxane bond, and a repeating unit other than these two repeating units, and a photosensitive agent consisting of an ester compound or an amide-ester compound of naphthoquinonediazidesulfonic acid or benzoquinonediazidesulfonic acid. The photosensitive composition is used as a passivation film of a semiconductor device or a photoresist.

Photosensitive composition and resin-encapsulated semiconductor device

Disclosed is a polysilane having a repeating unit represented by general formula (1) given below. Also disclosed is a polysilane composition, comprising a polysilane having a repeating unit represented by general formula (2) given below and a cross linking agent: ##STR1## where, each of R.sup.1 and R.sup.3 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms or a substituted or unsubstituted aryl group having 6 to 24 carbon atoms; R.sup.2 is a divalent hydrocarbon group having to 24 carbon atoms which can be substituted; R.sup.4 is a covalent bond, or a substituted or unsubstituted alkylene group having 1 to carbon atoms, or a substituted or unsubstituted arylene group having 6 to 24 carbon atoms; each of R.sup.5 to R.sup.9 is hydrogen, a substituted or unsubstituted alkyl group having 1 to 24 carbon atoms, a substituted or unsubstituted aryl group having 6 to 24 carbon atoms, or hydroxyl group, at least one of R.sup.5 to R.sup.9 being hydroxyl group; and X is a monovalent organic group having a reactive group capable of crosslinking upon exposure to light or by heating. If any of the polysilane and the polysilane composition of the present invention is exposed to light or heated, the polysilane molecules are crosslinked so as to provide a two or three dimensional polymer.

Polysilane and polysilane composition

Disclosed is a photosensitive resin composition for forming a polyimide film pattern. The composition contains a polyamic acid and at least one silyl ketone compound represented by general formula (II) given below, ##STR1## where each of R.sup.3 to R.sup.16 is a are substituted or unsubstituted alkyl group having 1 to 12 carbon atoms or a substituted or unsubstituted aromatic group having 6 to 14 carbon atoms, each of R.sup.5 to R.sup.16 may be a substituted or unsubstituted silyl group, and each of l, m, n, s, t and u is 0 or 1, at least one of l, m, n, s, t and u being 1. The composition further contains a sensitizer, as required. A semiconductor substrate is coated with the composition, followed by exposing the coating through a predetermined mask and subsequently developing and heat-treating the coating so as to form a polyimide film pattern.

Photosensitive resin composition for forming a polyimide film pattern

An epoxy resin composition containing an oxazoline compound in an epoxy resin.

Epoxy resin composition

Disclosed are photocurable compositions which comprise

Photocurable composition

A porous gas diffusion electrode for use in an air-metal cell or a hydrogen-air (oxygen) cell comprising an electroconductive porous substrate, which has itself on one surface thereof reaction gas feed channels or is to be used with one surface in contact with reaction gas feed channels during use, and which comprises gas impermeable and electrically insulating seals formed of a tetrafluoroethylene-perfluoroalkyl vinyl ether compolymer provided on the substrate at least at both end portions parallel to said reaction gas feed channels, is capable of positively shielding the gas streams at the end portions parallel to the reaction gas feed channels and maintaining electrical insulation. Such a porous gas diffusion electrode can be prepared by a method comprising applying a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer on the substrate at least at the end portions parallel to the reaction gas feed channels and then subjecting the substrate coated with the copolymer to hot pressure bonding by means of a pressure bonding tool made of a metal previously coated with a fluoride oil to form gas impermeable and electrically insulating seals comprising said copolymer.

Porous gas diffusion electrode and method of producing the same

A thermosetting resin composition containing as essential resin components (a) a maleimide compound modified with furfuryl alcohol, (b) an epoxy resin and (c) a polyvinyl formal, and a latent curing agent or a curing accelerator which is at least one compound selected from the group consisting of dicyandiamide, boron trifluoride-amine complexes, metal chelate compounds, and silicone compounds and organo-silane compounds having at least one hydroxyl group bonded directly to silicon atom, is found to be capable of B-staging with good storage stability and provides a heat-resistant resin composition having excellent electric characteristics at high temperatures after curing. The composition can suitably be coated on a glass cloth or a mica tape to give a pre-preg tape which can maintain its flexibility for a long time.

Growing community of inventors

Yokohama, Japan

Yukihiro Mikogami