Hitachi Techno Engineering Co., Ltd.

Yukihiro Kawasumi

Haruo Mishina

Tomio Yoneda

Shigeru Ishida

Satoshi Yawata

Kiyoshi Imaizumi

Hiroshi Tsutsumi

Masayuki Saito

A paste applicator for drawing a paste film in a desired pattern on a substrate, including a table for detachably supporting a substrate, a paste reservoir tube to be filled with a paste, and a nozzle communicating with the paste reservoir and having a paste discharging port opposing to an upper surface of the substrate mounted on the table. A device is supplied for changing the relative positional relationship between the nozzle and the substrate mounted on the table. The paste is applied onto the substrate to form a desired pattern of the paste. A measuring device measures a position of a paste discharging port of a nozzle exchanged together with the paste reservoir tube by using a paste pattern formed by applying the paste onto the substrate held on the table using the exchanged nozzle. The center of the paste pattern nearly agrees with the center of the paste discharging port. A calculator calculates a positional displacement of the paste discharging port due to the nozzle exchange using the measured result obtained by the measuring device. A positioning device positions the substrate at a desired position with respect to the paste discharging port after nozzle exchange using the result obtained by the calculator.

Paste applicator having positioning means

An apparatus for applying a paste to a surface of a substrate by holding the substrate on a table and by moving a nozzle relative to the table to form a desired paste pattern on the substrate. The apparatus has a device for measuring the position of a paste ejection orifice of the nozzle, a processing unit for calculating, from a result of the measurement by the measuring device, a displacement of the position of the paste ejection orifice when the nozzle is changed, and a mechanism for positioning the substrate at a desired position with respect to the ejection orifice of the changed nozzle on the basis of a result of the operation of the processsing unit. With this arrangement, even if the position of the ejection orifice of the nozzle is changed when the nozzle is changed, the desired positional relationship between the nozzle and the substrate can be set with improved accuracy, whereby a paste pattern can be drawn accurately.

Apparatus for applying paste

Growing community of inventors

Ryugasaki, Japan

Yukihiro Kawasumi