Denso Corporation

Nippondenso Co., Ltd.

Other

Desno Corporation

Yukihiro Kato

Hiroshi Nomura

Hironobu Baba

Yoshifumi Watanabe

Hiroshi Okada

Susumu Kuroyanagi

Minoru Tokuhara

Osamu Ina

Toshiki Kobayashi

Toru Murowaki

Toshio Fujimura

Hajime Katsuro

Kyutaro Hayashi

Yutaka Obikane

Tokio Kohama

Kiyohiko Watanabe

Masakiyo Sumitomo

Masahito Mizukoshi

Kazuyoshi Nagase

Osamu Ito

Akira Shintai

Takashige Saitou

Yasuyuki Kawabe

Kazuhisa Ikeda

Masatoshi Tokunaga

Yasuhiro Yamashita

Kan Kinouchi

Seiichirou Otake

Michitake Kuroda

Masahiro Asai

Masahiro Ogino

Haruhisa Koike

Iwao Yokomori

Eishi Kawasaki

Yosihumi Watanabe

Tomohiro Watanabe

A semiconductor device includes: a semiconductor substrate having a drift layer; a base layer and a carrier storage layer over the drift layer; a collector layer on the drift layer opposite to the base layer; multiple trenches penetrating the base layer and the carrier storage layer and reaching the drift layer; a gate electrode on an insulation film in each trench; and an emitter region in a surface portion of the base layer contacting each trench. A thickness of at least a portion of a part of the gate insulation film on a sidewall of each trench on a collector layer side from a peak position, at which the impurity concentration of the carrier storage layer is highest, is thicker than a thickness of another part of the gate insulation film on the sidewall of an opening portion side of the trench from the peak position.

Semiconductor device

A rotation detecting device for detecting a rotating object includes a housing having a bearing and an mounting surface, a rotor member having magnetic peripheral portion and a rotary shaft that is supported by the bearing, a biasing permanent magnet for providing magnetic field around the mounting surface and the magnetic peripheral portion, an IC sensor chip including plural magnetic sensor elements disposed on the mounting surface to provide a sensing signal related to change in magnetic field around the sensor elements, and an IC signal processing chip that provides a rotation signal according to the sensing signal. In this device, the bearing and the mounting surface are integrally formed into the housing at a prescribed distance to secure an unchanged air gap distance.

Rotation detecting device

A rotational angle detecting device includes a sensor portion disposed on a shaft. The sensor portion includes longitudinal hall elements disposed perpendicular to each other for outputting a hall voltage proportional to a magnetic flux induced by a magnet disposed on the shaft. The device also includes an engagement mechanism for maintaining a positional relationship with the magnet in which a center portion of the sensor is aligned with a center portion of the magnet.

Rotational angle detecting device

A rotation sensor has a sensor and a processing circuit that are provided as an integrated circuit chip (IC chip). The sensor has a magnetic resistance element. The rotation sensor senses an angular change of a magnetic vector as a change of resistance. The rotation sensor is located to face a rotor, or a helical gear used in an automatic transmission. The magnetic resistance element is located such that a sensing plane thereof is parallel to a hypothetical plane perpendicular to the line of inclination of each tooth of the rotor.

Rotational position sensor including a helical gear rotor and a magnetic resistance element

A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor and an outside circuit, and a port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor is disposed in the pressure introduction port, and electrically connects to the connector pin through a lead wire. The lead wire with the temperature sensor is supported by a connection portion disposed between the connector pin and the lead wire. The lead wire has a buffer disposed between the lead wire and a part of the pressure introduction port for reducing a vibration of both the temperature sensor and the lead wire.

Pressure sensor device having temperature sensor

A box-shaped electronic control unit for use in an automotive vehicle includes a pair of side stays for mounting the electronic control unit on a vehicle. The side stay integrally formed with a bottom cover is bent upward to form a bent portion. When electronic control units are carried by a conveyer, they are placed on a conveyer belt so that the bent portions face one another, thereby to avoid overlapping of the electronic control units on the conveyer belt. To form the side stay having a sufficient mechanical strength endurable against a high vibrating force of the vehicle, a pair of ribs extending from both sides of the bottom cover are formed on the side stays.

Electronic control unit for use in automotive vehicle

A pressure sensor device having a temperature sensor includes a pressure sensor, a temperature sensor, a sensor casing for accommodating the pressure sensor and a connector pin for electrically connecting the pressure sensor to an outside circuit, and an inlet port mounted on the sensor casing and having a pressure introduction port for introducing a measuring object to the pressure sensor. The temperature sensor comprises a temperature sensing element and a pair of lead wires and is disposed in the pressure introduction port. The lead wires of the temperature sensor are welded to and supported by the connector pin. One of the lead wires is formed as a U-shape and inserted into the pressure introduction port while the U-shaped lead wire is inwardly depressed, so that a reaction force is generated at the lead wire, which outwardly urges the lead wire and the temperature sensing element to an inner wall of the pressure introduction port. As a result, the temperature sensor is firmly fixed to the sensor device of a smaller size and a vibration of the temperature sensor can be suppressed.

A pressure sensor includes a sensor device and a diaphragm. The diaphragm is exposed to a fluid, a pressure relative to which is detected using the sensor device. The diaphragm is made of a material having a pitting index, which is defined by the equation, (Cr&plus;3.3Mo&plus;20N), of 50 or greater and Ni content of 30 weight % or greater to prevent the diaphragm from corroding due to the fluid.

Pressure sensor with a corrosion-resistant diaphragm

In a method for manufacturing a sensor apparatus having a sensor chip disposed in a recess of a case, after the sensor chip is disposed in the recess of the case, an opening portion of the recess is closed with a sheet member. The sheet member can prevent foreign matters from intruding an inside of the recess during manufacturing steps. After that, a through hole is formed in the sheet member. Accordingly, the inside and outside of the recess communicate with each other, and the sensor chip can detect an external environment of the recess such as atmospheric pressure.

Method for manufacturing sensor apparatus

The full bridge circuit in a pressure sensor including semiconductor piezoelectric resistive elements in a pressure detection structure is connected to a filter. That is, first and second output terminals of the full bridge circuit is connected to a capacitor. One end of the capacitor is connected to the first output terminal through a first resistor. The other end of the capacitor is connected to the second output terminal through a second resistor. In an exhaust system of an engine, the pressure of the exhaust gas is detected to detect clogging in the black smoke removing unit. The filter removes the pulsate component in the detection signal derived from the pulsate component in the exhaust gas.

Semiconductor pressure sensor and an exhaust system including the same

A semiconductor sensor chip includes a thin diaphragm and an electrical circuit formed on a front surface of the diaphragm. The diaphragm distorts according to a pressure difference between pressures applied on both surfaces of the diaphragm, and the diaphragm distortion is converted into an electrical signal. Both surfaces of the diaphragm are covered with protecting members to protect the sensor chip from dusts and moisture contained in the gas. Since the gas is introduced to the rear surface of the diaphragm through a small passage while the front surface receives pressure with a relatively large area, the protecting member covering the rear surface is made softer than that covering the front surface. Thus, the sensor chip is properly protected against dusts and moisture.

Pressure sensor having semiconductor sensor chip

A pressure detecting apparatus having a pressure introducing pipe is installed on an intake surge tank for detecting inner pressure in the intake surge tank. The intake surge tank is provided with a throttle passage having a throttle is disposed in the intake surge tank along a flow direction of the gas for increasing a flow speed of the gas. A pressure inlet at a leading end of the pressure introducing pipe is positioned in a vicinity of the throttle.

Pressure detecting apparatus and installation structure of same

In order to form a hollow portion in a resin block after a molding operation, a projection for forming a hollow portion in a resin block is formed on an upper die. A front face of the projection is processed into a mirror finished face (smoothed flat face). Recess portions are formed in the front face of the projection. The position of the recess portions correspond to wire bonding regions of a lead frame. The lead frame is clamped between an upper die and a lower die. A molding resin is injected into a space between the upper and lower dies. As a result, an excellent wire bonding face can be secured at regions on the lead frame in correspondence with the recess portions.

Resin sealing type semiconductor device

An IC chip for signal processing circuit is enclosed in a mold IC and a pressure sensitive element unit is integrally provided thereon. When the mold IC is housed in a case, the mold IC is fixed to the case under a state where ends of connector pins insert-molded to the case are electrically connected to external terminals of the mold IC. Thereby, a sensor signal is outputted from other ends of the connector pins. By integrating the IC chip for signal processing circuit in the mold IC, the IC chip for signal processing circuit can be protected against a contaminated environment at a location where the pressure sensitive element unit is arranged.

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Kariya, Japan

Yukihiro Kato