Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Matsushita Industrial Co., Ltd.

Yukihiro Ishimaru

Takashi Kitae

Hiroaki Takezawa

Tsutomu Mitani

Tousaku Nishiyama

Yasuhiro Sugaya

Toshiyuki Asahi

Yasuhiro Suzuki

Takeshi Nakayama

Yoshiyuki Saito

Seiji Karashima

Masahiro Takatori

Tsukasa Shiraishi

Hideo Hatanaka

Kazunori Sakamoto

Tosaku Nishiyama

Masahiro Ishii

Shigeaki Sakatani

Eiji Takahashi

Satoru Tomekawa

Akio Furusawa

Hideki Iwaki

Hidetoshi Kitaura

Taichi Nakamura

Hiroki Yabe

Shinobu Masuda

Kouichi Ishino

Seiichi Natkatani

Tsutomi Mitani

An IC current measuring apparatus is provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one of a plurality of substrate-facing terminals. Especially, resistances are each inserted into a path between an IC terminal targeted for measurement and a substrate terminal corresponding thereto. Furthermore, the IC current measuring apparatus is provided with terminals each used to measure a voltage between both ends of an inserted resistance corresponding thereto. Accordingly, a measurer who measures current flowing through an IC-facing terminal can measure the current flowing through the IC-facing terminal by providing the IC current measuring apparatus between the IC targeted for measurement and the substrate and measuring a voltage between both ends of an inserted resistance corresponding to the IC terminal through which current he/she wishes to measure flows.

IC current measuring apparatus and IC current measuring adapter

A bonding structure body in which a semiconductor element and an electrode are bonded via a solder material, wherein a part that allows bonding has a first intermetallic compound layer that has been formed on the electrode side, a second intermetallic compound layer that has been formed on the semiconductor element side, and a third layer that is constituted by a phase containing Sn and a sticks-like intermetallic compound part, which is sandwiched between the two layers of the first intermetallic compound layer and the second intermetallic compound layer, and the sticks-like intermetallic compound part is interlayer-bonded to both of the first intermetallic compound layer and the second intermetallic compound layer.

Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body

A module board has a configuration in which a first circuit board, a first composite sheet, a second circuit board, a second composite sheet, and a third circuit board are laminated in this order. Inspection terminals are arranged in a matrix shape in a predetermined region on an upper surface of the third circuit board. Electronic components are mounted on the first and second circuit boards. The inspection terminals are electrically connected to the electronic components mounted on the first and second circuit boards through vias and wiring patterns.

Module board

One of an electrode terminal of an electronic component and a connecting terminal of a wiring substrate is provided with solder beforehand, one of the wiring substrate and the electronic component is secured, and the electrode terminal and the connecting terminal are made to abut each other so that one of the wiring substrate and the electronic component, whichever is not secured, is held. The electronic component is heated so that the solder melts, and the solder is solidified while the electronic component is held, so that the electrode terminal and the connecting terminal are bonded to each other by the solder. Further, while an interval formed between the wiring substrate and the electronic component by the melted solder is being held, the electrode terminal and the connecting terminal are finely moved relative to each other with reference to a surface of the wiring substrate in an XY&#x3b8; direction.

Electronic component mounting method and electronic component mounting device

A highly reliable, high-productivity package equipped with a semiconductor chip, and a method for producing the same. In a package () comprising a semiconductor chip () and a mounting substrate (), a plurality of electrode terminals () are formed on the surface () of the semiconductor chip () opposing the mounting substrate side, connection terminals () respectively corresponding to the plurality of electrode terminals (), are formed on the mounting substrate (), the connection terminals () on the mounting substrate () and the electrode terminals () are electrically connected collectively by solder bumps () formed in self-assembly, an electrode pattern () not connected with the electrode terminals () and the connection terminals () is formed on the chip surface () or the surface () of the mounting substrate () corresponding to the chip surface (), and solder () is accumulated on the electrode pattern ().

Package equipped with semiconductor chip and method for producing same

A stacked device is disclosed which is easily manufactured while identifying a plurality of devices that are stacked in the stacked device. The stacked device includes a stack of a plurality of slave devices and a master device having identical terminal arrangements. Here, the master device includes command transmission unit configured to input an identification command to a terminal of an adjacent slave device. Furthermore, the slave device includes a through-wire for interconnecting at least one terminal of that same device and an adjacent slave device; command reception unit configured to receive the identification command; and ID (identifier) setting unit configured to set the ID of that same device based on the identification command; the positions of the terminals that are interconnected with the adjacent slave devices differing in each slave device, so that, in each slave device, the slave device command reception unit receive an identification command having a modified value as a result of transiting through-wires that are connected at differing positions in each slave device.

Slave device, master device and stacked device

A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating layer, a second wiring pattern provided on a second main surface different from the first main surface of the insulating layer, and an electronic component such as a semiconductor chip or the like provided in an internal portion of the insulating layer. The electronic component includes a first external connection terminal formed on a first surface and a second external connection terminal formed on a second surface different from the first surface. The first external connection terminal is connected electrically to the first wiring pattern, and the second external connection terminal is connected electrically to the second wiring pattern.

Circuit board with built-in electronic component and method for manufacturing the same

A circuit component built-in module includes the following: an electrical insulating substrate made of a first mixture including a filler and a thermosetting resin; a wiring pattern formed on at least a principal surface of the electrical insulating substrate; circuit components that are arranged inside the electrical insulating substrate and connected electrically to the wiring pattern; and vias for electrically connecting the wiring patterns. At least one of the circuit components is mounted using wires. Part or all of the wires is sealed with a second mixture including a filler and a resin. This circuit component built-in module can eliminate a wire failure or short circuit while using a low cost mounting technique such as wire bonding.

Circuit component built-in module and method for manufacturing the same

A surface of an external electrodeof an electronic partis formed with a coating containing resin ingredient. Thereby, adhesion strength and reliability may be significantly improved in mounting an electronic part onto a circuit boardthrough the medium of a conductive adhesive. Further, it will be able to mount an electronic part to an element to be mounted by utilizing a conductive adhesive forming an external electrodeas a connecting element. Further, surface roughness (R) of an external electrodeof an electronic part is set to 0.1 &#x3bc;m or more and to 10.0 &#x3bc;m or less and preferably to 1.0 &#x3bc;m or more and to 5.0 &#x3bc;m or less. Thereby, adhesion strength with a conductive adhesive may be significantly enhanced in comparison with a conventional electronic part presented.

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

A mount assembly which amplifies a light signal from an optical transmission line and transmits the light signal to another optical transmission line and does not require a highly precise perpendicularity at a connection portion between the optical transmission line and the mount assembly. The mount assembly () is obtained by connecting a photo-electro conversion device (), spherical semiconductor devices () and () and an electro-photo conversion device () through electrical-connection portions () so that a light received by the photo-electro conversion device () is amplified by the spherical semiconductor devices () and () and then emitted from the electro-photo conversion device ().

Mount assembly, optical transmission line and photoelectric circuit board

A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesiveon a substrate electrodeof a circuit substrateand also for packaging an electronic element. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.

Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same

Electronic part, an electronic part mounting element and a process for manufacturing such the articles

A conductive adhesive agent of the invention contains an elution preventing film-forming agent , which becomes reactive after electric continuity through a conductive particle appeared in the conductive adhesive agent when a binder resin is being hardened, to thereby form an elution preventing film on a surface of the conductive particle . By using this conductive adhesive agent, the packaging structure is made migration resistant and sulfurization resistant.

Growing community of inventors

Osaka, Japan

Yukihiro Ishimaru