Kabushiki Kaisha Toshiba

Toshiba Infrastructure Systems & Solutions Corporation

Yukihiro Ikeya

Takeshi Toyoshima

Taketo Shiba

Motojiro Shibata

Yusuke Mitsuya

Taizo Tomioka

Tetsuya Kubo

Hiroaki Fujihara

Toshikazu Taki

Takahiro Aizawa

Sadayuki Sasaki

Ko Miyauchi

Yoshihide Nakamura

According to one embodiment, a holding device includes a first holder configured to hold an upper surface of an article, and a second holder configured to hold a side surface of the article. The holding device performs at least a first operation of the first and second holders holding the article, and a second operation of only the first holder holding the article.

Holding device, cargo handling apparatus, and holding method

According to one embodiment, a suction gripping device includes a pad mechanism mounted to a base. The pad mechanism includes a sliding part and a first guide. The sliding part includes a suction pad and a pipe and is slidable in a first direction with respect to the base. The suction pad attaches to a workpiece and is connected to the pipe at one end of the pipe. The first guide guides a sliding direction of the pipe to be in the first direction. The first guide is fixed with respect to the base. An attachment surface of the suction pad contacts a first surface of a workpiece and is tiltable due to a weight of the sliding part when gripping the workpiece. The first surface crosses a sliding direction of the sliding part.

Suction gripping device, transfer system, and transfer method

A holding device includes a supporter, a gripper, and a first driver. The supporter supports a weight of a workpiece in a first direction. The gripper includes a gripping surface that grips the workpiece in a second direction crossing the first direction. The first driver moves the supporter with respect to the gripper in the second direction. A tilt of the supporter is changeable with respect to the gripping surface along a plane including the first and second directions.

Holding device, transfer system, support device, placement method, and transfer method

According to an embodiment, a surface treatment apparatus includes a surface treatment portion, a supporter, and a carrying portion. The surface treatment portion has a treatment surface. The supporter has a support surface facing a second surface opposite to the first surface of the work. A frictional coefficient of the second surface and the support surface is higher than a frictional coefficient of the first surface and the treatment surface. The carrying portion applies a load in a direction in which the support surface is relatively pressed on the treatment surface, moves the support surface in a carrying direction different from the direction of the load, and thereby moves the work in the carrying direction.

Surface treatment apparatus, and surface treatment method

The present invention provides a battery including a container, an electrode group including a positive electrode and a negative electrode, multiple current collecting tabs being extended from any one of the positive electrode and the negative electrode of the electrode group, and overlapped with one another; a lead bonded to at least one of the current collecting tabs by ultrasonic bonding, a lid configured to close an opening portion of the container, and an external terminal provided on the lid and connected to the at least one current collecting tab via the lead, in which the lead has a cross-sectional area that is increased in a middle of extension of the lead from an ultrasonic-bonded portion to the at least one of the current collecting tabs to the external terminal.

Battery and ultrasonic bonding method for battery

A method of bonding a semiconductor chip, including step of photographing a surface of a semiconductor chip, on which an electrode is formed, and detecting a relative position of the electrode with respect to the semiconductor chip, a bonding step of making the electrode of the semiconductor chip to face a circuit pattern provided on a substrate, and bonding the electrode to the circuit pattern, a step of photographing the substrate on which the semiconductor chip is formed, and detecting a relative position of the semiconductor chip with respect to the substrate. Also included is a step of evaluating a bonding accuracy by calculating a relative position of the electrode with respect to the substrate from the relative position of the semiconductor chip with respect to the substrate and the relative position of the electrode with respect to the semiconductor chip.

Growing community of inventors

Yokohama, Japan

Yukihiro Ikeya