Murata Manufacturing Co., Ltd.

Yukihiro Fujita

Tadateru Yamada

Kosuke Nakano

Hideki Otsuka

Shogo Kanbe

Seiji Hidaka

Shinichiro Kuroiwa

Hirobumi Adachi

Takayuki Okada

Kazuhiro Tabata

Shunsuke Abe

Yohei Yamaguchi

Takashi Fukuma

A multilayer ceramic capacitor includes a capacitor body, first and second via-conductors, first and second extended electrode portions, first and second outer electrodes, and an insulative resin. The capacitor body includes first and second inner electrodes. The first and second via-conductors are inside the capacitor body, and are respectively electrically connected to the first and second inner electrodes. The first and second extended electrode portions are respectively electrically connected to the first and second via-conductors. The first and second extended electrode portions are located on an outer surface of the capacitor body so as to extend to locations different from locations at which the first and second extended electrode portions are connected to the first and second via-conductors. The first and second outer electrodes are respectively electrically connected to the first and second extended electrode portions.

Multilayer ceramic capacitor including via-conductors and outer electrodes

A multi-terminal multilayer capacitor includes first vias and second vias extending in first and second internal electrodes in a stacking direction, a first slit extending between the first via and a first insulating portion that insulates the second via and the first internal electrode from each other, and a second slit extending between the second via and a second insulating portion that insulates the first via and the second internal electrode from each other. The first via electrically connects regions of the first internal electrode split by the first slit, and the second via electrically connects regions of the second internal electrode divided by the second slit.

Multi-terminal multilayer capacitor

A chip electronic component includes spacers that each have a predetermined thickness direction dimension on a mounting surface in a direction perpendicular to the mounting surface. The spacers each contain, as a main component, an intermetallic compound containing at least one high-melting-point metal selected from Cu and Ni, and Sn defining a low-melting-point metal.

Chip electronic component

A multilayer capacitor includes a capacitor main body including dielectric layers, first inner electrodes, and second inner electrodes that are laminated together, first outer electrodes, second outer electrodes, first via conductors that electrically connect the respective first outer electrodes to the first inner electrodes, and second via conductors that electrically connect the respective second outer electrodes to the second inner electrodes. Through holes are provided in the second inner electrodes, and the first via conductors pass through the through holes. Through holes are provided in the first inner electrodes, and the second via conductors pass through the through holes. The first outer electrodes and the second outer electrodes are not provided on the first principal surface of the capacitor main body and provided only on its second principal surface.

Multilayer capacitor and multilayer capacitor array

An electronic component module includes a second terminal electrode that is independent of a first terminal electrode in terms of potential. A second electronic component is mounted on a board, with a first surface thereof facing the board. A heat transfer portion is disposed on a second surface of the second electronic component, the heat transfer portion being connected to both the first terminal electrode and the second terminal electrode. A heat dissipation portion is connected to the board via the first terminal electrode, the second terminal electrode, and the heat transfer portion.

Electronic component module, electronic component unit, and method for manufacturing electronic component module

An electronic component includes a multilayer capacitor and an interposer including a substrate main body with an electric insulation property, the multilayer capacitor being mounted on one main surface side of the substrate main body. The multilayer capacitor includes a multilayer body, a first outer electrode, and a second outer electrode. The multilayer body includes an effective region and a non-effective region surrounding the effective region. A width of the effective region is larger than a width of the substrate main body, when a width of the multilayer body is represented by W, a thickness of the multilayer body is represented by T, and a thickness of the substrate main body is represented by T, a value of W/(T+T) is not less than about 0.90 and not more than about 1.10.

Electronic component

A multilayer capacitor built-in substrate includes a core substrate, a multilayer capacitor mounted on one principal surface of the core substrate, and a burying layer provided on the one principal surface of the core substrate to bury the multilayer capacitor. The multilayer capacitor includes a laminated body in which dielectric layers and internal electrode layers are laminated, and first and second external electrodes. The laminated body includes an effective region in which internal electrode layers respectively connected to the first external electrode and the second external electrode are laminated with a dielectric layer located therebetween, and a non-effective region surrounding the effective region. The core substrate includes, on the one principal surface, a first land electrode electrically connected to the first external electrode and a second land electrode electrically connected to the second external electrode.

Multilayer capacitor built-in substrate

A monolithic ceramic capacitor includes a plurality of first and second inner electrodes in a ceramic body. A direction in which the first and second inner electrodes are stacked is a stacking direction, a direction perpendicular or substantially perpendicular to the stacking direction in the ceramic body is a length direction, and a direction perpendicular or substantially perpendicular to the stacking direction and the first direction is a width direction. The ceramic body includes an effective portion, a first outer layer portion, a second outer layer portion, a first side portion, and a second side portion. A ratio A/B is about 0.04 or less when a dimension of each of the first side portion and the second side portion in the width direction is A and a dimension of the effective portion in the stacking direction is B.

Monolithic ceramic capacitor, monolithic ceramic capacitor array, and monolithic ceramic capacitor mounting structure

An electronic component includes an electronic element including two outer electrodes on surfaces thereof and a board terminal including a board main body and two mounting electrodes. The board main body has electrical insulating properties and a first principal surface. The two mounting electrodes are disposed on the first principal surface and electrically coupled to the two outer electrodes, respectively. The electronic element is mounted on the first principal surface side. The two outer electrodes are partially disposed outside an outer edge of the board terminal when viewed from the first principal surface side. The height from an end of each of the two outer electrodes opposite the board terminal to an end of the board terminal opposite the electronic element is not greater than a larger dimension of the width of the electronic element and the width of the board terminal.

Growing community of inventors

Nagaokakyo, Japan

Yukihiro Fujita