Tokyo Electron Limited

Jsr Corporation

Yuki Yoshida

Hisashi Kawano

Meitoku Aibara

Kazuyoshi Shinohara

Satoru Tanaka

Masami Yamashita

Itaru Kanno

Motoyuki Shima

Kenji Mochida

Yosuke Kawabuchi

Koji Kagawa

Hiroyuki Suzuki

Kotaro Oishi

Norihiro Ito

Kazuhiro Aiura

Yoshihiro Kai

Yoshinori Ikeda

Tetsuya Oda

Hidetoshi Nakao

An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

Substrate processing system, substrate cleaning method, and recording medium

A substrate processing apparatus includes a substrate rotating unitconfigured to hold and rotate a substrate; a processing liquid supplying unitconfigured to supply a processing liquid to the substrate; and a replacement liquid supplying unitconfigured to supply, to the substrate, a replacement liquid with which the processing liquid supplied from the processing liquid supplying unit is replaced. While the replacement liquid supplying unitsupplies the replacement liquid to the substrate, the processing liquid supplying unitsupplies the processing liquid to a position on the substrate positioned at an outer peripheral side thereof than a supply position of the replacement liquid to form a liquid film of the processing liquid. It is possible to maintain a state in which the entire surface of the substrate is covered with the liquid film without increasing consumption amount of the replacement liquid.

Substrate processing apparatus, substrate processing method, and computer-readable recording medium having stored thereon substrate processing program

An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatusthat processes a substratewith a processing liquid and dries the substrateincludes a substrate rotating deviceconfigured to rotate the substrate; a processing liquid discharging unitconfigured to discharge the processing liquid toward the substrate; a substitution liquid discharging unitconfigured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate, toward the substratewhile relatively moving with respect to the substrate; and an inert gas discharging unitconfigured to discharge an inert gas toward a peripheral portion of the substratein an inclined direction from above the substratewhile moving in a direction different from a direction in which the substitution liquid discharging unitis moved.

Substrate processing apparatus

In order to remove from a substrate having a concavo-convex pattern formed on a surface of the substrate, a solid material with which a concave portion of the concavo-convex pattern is filled and which is formed by evaporating a solvent in a sublimable substance solution containing a sublimable substance that sublimates at a temperature equal to or higher than a first temperature, and an impurity that evaporates at a temperature equal to or higher than a second temperature that is higher than the first temperature, the prevent invention provides a substrate processing apparatus and a substrate processing method which heat the substrate to a temperature equal to or higher than the second temperature.

Substrate processing apparatus and substrate processing method

An object of the present invention is to be able to obtain a high removing performance of particles. The substrate processing method according to the exemplary embodiment comprises a film-forming treatment solution supply step and a removing solution supply step. The film-forming treatment solution supply step comprising supplying to a substrate, a film-forming treatment solution containing an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent is supplied. The removing solution supply step comprises supplying to a treatment film formed by solidification or curing of the film-forming treatment solution on the substrate, a removing solution capable of removing the treatment film.

Substrate cleaning method and recording medium

Substrate processing apparatus, substrate processing method and computer-readable storage medium recording therein substrate processing program

A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate.

A substrate processing apparatus according to the present disclosure includes first and second nozzles that eject a processing liquid to a substrate; a moving mechanism that moves the first and second nozzles; and a nozzle cleaning device that cleans at least the second nozzle. The nozzle cleaning device includes a cleaning bath and an overflow bath. The cleaning bath includes a liquid storage portion that stores a cleaning liquid for cleaning the second nozzle, and an overflow portion that discharges the cleaning liquid exceeding a predetermined level from the liquid storage portion. The overflow bath is disposed adjacent to the cleaning bath and receives the cleaning liquid discharged from the overflow portion and discharge the received cleaning liquid to the outside.

Growing community of inventors

Koshi, Japan

Yuki Yoshida