Torex Semiconductor Ltd.

Katoh Electric Co., Ltd.

Yuki Yasuda

Shinya Sato

Yojiro Shiina

An electronic device comprises a semiconductor chip, an accommodating part that accommodates the semiconductor chip, a plurality of terminals that are provided along a first side of a first surface and along a second side opposite to the first side with respect to the semiconductor chip, the plurality of terminals being electrically connected to the semiconductor chip and being exposed on the rectangular first surface of the accommodating part, and a plurality of conductive members that penetrate from the first surface of the accommodating part to the second surface opposite to the first surface.

Electronic device

To increase a current that can be supplied to an electronic element mounted on an upper surface of a semiconductor package. An electronic device includes a semiconductor chip, a package that accommodates the semiconductor chip, a plurality of terminals that is electrically bonded with the semiconductor chip and is exposed on a first surface of the package, and at least one copper post that penetrates from the first surface of the package to a second surface opposite to the first surface, and that has a cross sectional area in the direction of the first surface, which is larger than the area of the plurality of terminals on the first surface.

Growing community of inventors

Yamanashi, Japan

Yuki Yasuda