Mitsubishi Electric Corporation

Nippon Telegraph and Telephone Corporation

Mitsubishi Heavy Industries Limited

Yuki Yano

Satoru Ishikawa

Shohei Ogawa

Takeshi Kuwahara

Kiyoshi Arai

Nobuyuki Kamihara

Shinsuke Asada

Naoki Higo

Toshimitsu Tsubaki

Takuma Tsubaki

Kojun Koshiji

Masanao Nakano

Kazuhisa Osada

Takayuki Onaka

Takao Kurahashi

An object is to provide a technique that can suppress wet-spreading of an adhesive used to bond a case and a metal base to each other and secure the height position of the adhesive required to fill a gap created between the case and the metal base. A semiconductor device includes a metal base, an insulating substrate arranged on the metal base, a semiconductor element mounted on the insulating substrate, and a case bonded on the metal base so as to surround side surfaces of the insulating substrate and the semiconductor element, in which a pair of metal oxide films having a protruding shape is provided on a peripheral edge portion of the metal base, and the case is bonded to the metal base by an adhesive arranged in a region between the metal oxide films in the pair.

Semiconductor device and method of manufacturing semiconductor device

A message relay apparatus and a message relay method that achieve high message reachability taking communication network situation into consideration are provided. A message relay apparatusinterposed between an applicationand a deviceincludes a device communication state determination functional unitthat determines communication availability with the device, a network state estimation unitthat estimates a network state based on the communication availability, and a message processing unitthat determines forwarding availability of an application message based on the network state and buffers the application message when forwarding is not available.

Message relay apparatus and method

An object is to provide a semiconductor device which suppresses poor bonding between a metal pattern and an electrode terminal due to insufficient temperature rise at the time of bonding the metal pattern and the electrode terminal. The electrode terminal is branched into a plurality of branch portions in a width direction on one end side of an extending direction thereof, of the plurality of branch portions, a first branch portion and a second branch portion are bonded on the metal pattern via a bonding material, respectively, the first branch portion has a wider width than that of the second branch portion, and the bonding material between the second branch portion and the metal pattern is thinner than the bonding material between the first branch portion and the metal pattern.

Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device

An object is to provide a semiconductor device in which heat generated in a lead electrode when conducting a large current can be reduced and the bonding quality between the lead electrode and a semiconductor element can be inspected easily. A semiconductor device includes: a base portion; a semiconductor element mounted on the base portion; a metal part erect with respect to the semiconductor element and having one end bonded, with a bonding material, to a principal surface of the semiconductor element opposite to another principal surface of the semiconductor element mounted on the base portion; and a lead electrode connected to the semiconductor element through the metal part. The lead electrode includes a through hole extending in a thickness direction. The metal part connects the semiconductor element to the lead electrode, while inserted into the through hole of the lead electrode together with a part of the bonding material.

Semiconductor device comprising a lead electrode including a through hole

A duct includes: a tube that is formed to extend from an indoor of a building or a movable body and that allows an outside and the indoor to communicate with each other; an electromagnetic wave inhibiting sloped surface that is formed on an inner surface of the tube and extends to be sloped to approach an axial line of the tube from the outside toward the indoor in an axial direction of the tube and that reflects an electromagnetic wave; and an electromagnetic wave selecting inner peripheral member that has a tubular shape covering the electromagnetic wave inhibiting sloped surface from an inner peripheral side and is capable of selectively transmitting only an electromagnetic wave of a specific frequency incident on the tube.

Duct

Growing community of inventors

Tokyo, Japan

Yuki Yano