Nihon Dempa Kogyo Co., Ltd.

Japan Aerospace Exploration Agency

Yuki Yanagisawa

Hiroyuki Kukita

Shohei Nakagawa

Tsuyoshi Shiobara

Eiji Miyazaki

Yuta Tsuchiya

A sensing device is provided. The sensing device includes a heat regulation mechanism to regulate a temperature of a piezoelectric resonator corresponding to a voltage, and uses a sensing sensor to cause a sensing object to adsorb to and desorb from the piezoelectric resonator by increase and decrease of the temperature. A drive voltage is regulated to regulate an amplification factor of a heat regulation voltage input to a drive voltage regulator that regulates the temperature of the heat regulation mechanism corresponding to the type of a sensing sensor connected to a device main body. Therefore, when a CQCM sensor that heats a crystal resonator using a heater circuit and a TQCM sensor that regulates a heat of the crystal resonator sing a Peltier element are each used, regulation ranges of the driving powers supplied to the respective heater circuit and Peltier element can be changed.

Sensing device

A sensing device that senses a substance to be sensed as a gas by causing a piezoelectric resonator to adsorb the substance to be sensed, includes: a substrate, a thermoelectric element unit, a support plate, and a base portion. A sensing module unit in which a substrate, a thermoelectric element unit, and a support plate are integrated is removably disposed to a base portion that performs at least one of heat supply and heat dissipation to the thermoelectric element unit.

A sensing sensor includes an oscillator circuit, a base, a connection portion, and a temperature changing unit. The oscillator circuit oscillates the piezoelectric resonator. The base includes a base main body in which a depressed portion is provided and a lid portion at one side, supports the piezoelectric resonator at another side, and is for taking the oscillation frequency to an outside of the sensing sensor. The depressed portion houses the oscillator circuit. The lid portion covers the depressed portion. The connection portion is disposed at the one side of the base and connected to a cooling mechanism for cooling the base from the one side. The temperature changing unit is interposed between the piezoelectric resonator and the base, so as to cool and heat the piezoelectric resonator and transfer a heat radiated for cooling the piezoelectric resonator from the other side of the base to the one side.

Growing community of inventors

Saitama, Japan

Yuki Yanagisawa